36results about How to "Interference with control signal transmission" patented technology

The invention relates to a secondary plating-prior-to-etching metal frame subtraction imbedded chip flip bump structure and a process method. The structure comprises a metal substrate fame (1). The metal substrate fame (1) is internally provided with base islands (2) and pins (3). The pins (3) are in step shapes. The back surface of each base island (2) is flush with the step surface of each pin (3). The back surface of each base island (2) and the step surface of each pin (3) are invertedly equipped with a chip (6) through bottom filling glue (5). The metal substrate fame (1) is internally filled with plastic packaging material (7). The front surface of the plastic packaging material (7) is flush with the step surface of the pin (3). The back surface of the plastic packaging material (7) is flush with the back surface of the metal substrate fame (1). The front surface of the base island (2), the front surface and the back surface of each pin (3) as well as the front surface and the back surface of the metal substrate fame (1) are provided with an anti-oxidation layer (4). The back surface of each pin (3) is provided with a metal ball (9). The beneficial effect of the structure and method is that: the problem that the function and the application performance of a conventional metal lead frame are limited since an object cannot be imbedded in the metal lead frame with such plate thickness is solved.

The invention relates to a secondary first-corrosion-then-plating metal frame subtraction burying chip obverse-mounting flat foot structure and technology method. The structure comprises a metal base plate frame (1), a base island (2) and a pin (3) are arranged in the metal base plate frame (1), the pin (3) is in a step shape, the back face of the base island (2) and the step face of the pin (3) are flush, a metal layer (4) is arranged on the step face of the pin (3), a chip (6) is arranged on the back face of the base island (2) in an obverse mode, the surface of the chip (6) and the surface of the metal layer (4) are connected through a metal wire (7), the inner zone of the metal base plate frame (1) is filled with moulding compounds (8), the front face of the moulding compounds (8) is flush with the step face of the pin (3), the back face of the moulding compounds (8) is flush with the back face of the metal base plate frame (1), and anti-oxidation layers (9) are arranged on the front face of the base island (2), the front face and the back face of the pin (3) and the front face and the back face of the metal base plate frame (1). The structure has the advantages that the problem that an object cannot be buried into plate thickness of a traditional metal lead frame, so that the function and the application performance of the metal lead frame are limited can be solved.

The invention relates to a one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged salient point structure and a technological method. The one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged salient point structure is characterized in that a metal substrate frame is included, a paddle and pins are arranged in the metal substrate frame, the pins are of a step shape, the front face of the paddle and the front faces of the pins are aligned with the front face of the metal substrate frame, the back faces of the pins are aligned with the back face of the metal substrate frame, the back face of the paddle is aligned with the step faces of the pins, metal layers are arranged on the step faces of the pins, a chip is arranged on the back face of the paddle through conducting or non-conducting adhesion substances, the front face of the chip is connected with the surfaces of the metal layers on the step faces of the pins through metal wires, plastic packaging materials wrap the paddle, the pins, the chip and the metal wires, and anti oxidation layers are plated on or organic solderability preservative (OSP) wraps the front face of the paddle, the front faces and the back faces of the pins and the surface of the metal substrate frame. Metal balls are arranged on the back faces of the pins. The one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged salient point structure has the advantages of being capable of solving the problem that the function and the application performance of a metal wire frame are restricted due to the fact that objects cannot be buried in the thickness of the traditional metal wire frame.

The invention relates to a packaging-prior-to-etching type three-dimensional system-level chip-flipped bump packaging structure and a process method thereof. The structure comprises a pad and pins, wherein a first chip is arranged on the front surface of the pad; second chips are flipped on the back surfaces of the pad and the pins through bottom filling adhesives; the front surfaces of the first chip and the pins are connected through metal wires; conductive columns are arranged on the front surfaces of the pins; molding compounds are encapsulated in the peripheral area of the pad, the areas between the pad and the pins and between each two pins, the upper areas of the pad and the pins, the lower areas of the pad and the pins, and the external areas of the first chip, the second chips, the metal wires and the conductive columns; anti-oxidation layers are plated on the surfaces, exposed from the molding compounds, of the pins and the conductive columns; and metal balls are arranged on the tops of the conductive columns. By virtue of the packaging-prior-to-etching type three-dimensional system-level chip-flipped bump packaging structure and the process method thereof, the problem of limitation of the whole packaging functional integrity caused by difficulty in embedding of an object into a conventional metal lead frame or a conventional organic substrate can be solved.

The invention relates to a primary plating-prior-to-etching metal frame subtraction imbedded chip normal-installation flat pin structure and a process method. The structure comprises a metal substrate frame. The metal substrate frame is internally provided with base islands and pins. The pins are in step shapes. The front surface of each base island and the front surface of each pin are flush with the front surface of the metal substrate frame. The back surface of each pin is flush with the back surface of the metal substrate frame. The back surface of each base island is flush with the step surface of each pin. The step surface of each pin is provided with a metal layer. The back surface of each base island is provided with a chip through conductive or non-conductive bonding material. The front surface of the chip is connected with the surface of the metal layer on the step surface of each pin through a metal line. The front surface of the base island, the front surface and the back surface of each pin as well as the surface of the metal substrate frame are plated with an anti-oxidation layer or a coated antioxidant (OSP), wherein plastic packaging materials are flush with the anti-oxidation layers or coated antioxidants (OSP) on the upper and lower surfaces of the metal substrate frame. The beneficial effect of the structure and method is that: the problem that the function and the application performance of a conventional metal lead frame are limited since an object cannot be imbedded in the metal lead frame of such plate thickness is solved.

The invention relates to a convex point packaging structure and a technique of a horizontal chip of a firstly-etched and then-packaged three-dimensional system level. The structure comprises pads and pins, wherein first chips and second chips are arranged on front sides and rear sides of the pads; front sides of the first chips and the second chips are connected with the front sides and the rear sides of the pins through metal wires respectively; conductive columns are arranged on the front sides of the pins; the peripheral areas of the pads, the areas between the pads and the pins and among the pins, the areas of the upper parts and the lower parts of the pads and the pins and outsides of the first chips, the second chips, the metal wires and the conductive columns are packaged with a molding compound; surfaces, exposing out the molding compound, of the conductive columns are plated with an anti-oxidation layer; and metal balls are arranged at the tops of the conductive columns. According to the convex point packaging structure and the technique of the horizontal chip of the firstly-etched and then-packaged three-dimensional system level, the problem that the integration of a whole packaging function is limited due to the fact that an object cannot be embedded into a conventional metal lead frame or an organic multilayer circuit substrate is solved.