One-time eroding-before-plating metal frame subtraction embedded chip normally-arranged flat foot structure and technological method

Abstract

The invention relates to a one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged flat foot structure and a technological method. The one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged flat foot structure is characterized in that a metal substrate frame is included, a paddle and pins are arranged in the metal substrate frame, the front face of the paddle and the front faces of the pins are aligned with the front face of the metal substrate frame, the back faces of the pins are aligned with the back face of the metal substrate frame, the back face of the paddle is aligned with the step faces of the pins, metal layers are arranged on the step faces of the pins, a chip is arranged on the back face of the paddle through conducting or non-conducting adhesion substances, the front face of the chip is connected with the surfaces of the metal layers on the step faces of the pins through metal wires, plastic packaging materials wrap the paddle, the pins, the chip and the metal wires, the plastic packaging materials are aligned with the upper surface and the lower surface of the metal substrate frame, and anti oxidation layers are plated on or organic solderability preservative (OSP) wraps the front face of the paddle, the front faces and the back faces of the pins and the surface of the metal substrate frame. The one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged flat foot structure has the advantages of being capable of solving the problem that the function and the application of a metal wire frame are restricted due to the fact that objects cannot be buried in the thickness of the traditional metal wire frame.

Description

Technical field [0001] The present invention involves a one -to -be -plated chip with a flat -footed flat -foot structure and process method.It belongs to the field of semiconductor packaging technology. Background technique [0002] There are two main types of traditional four -sided flat -footed metal lead frame structure: [0003] One is a four -sided flat -free feet package (QFN) lead frame. The lead frame of this structure consists of a copper metal frame and a high -temperature -resistant glue film (such as Figure 15 Show). [0004] One is the pre -packaged sealing flat without quotation packaging (PQFN) lead box. The leading frame structure of this structure includes a pins and the Kidam. Figure 16 Show). [0005] The following shortcomings have the following disadvantages: [0006] 1. The traditional metal lead box as the packaging carrier of the loading chip, which itself does not have system functions, thereby limiting the integrated functionality and application perfor...

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a kind of first etch first and then plate metal frame subtraction buried chip front mounting flat leg structure and process method, which can solve the problem of traditional metal Problems with lack of system functionality in leadframes

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