Subtractive buried chip front-mounted flat leg structure and process method of metal frame plating after secondary etching

Abstract

The invention relates to a secondary first-corrosion-then-plating metal frame subtraction burying chip obverse-mounting flat foot structure and technology method. The structure comprises a metal base plate frame (1), a base island (2) and a pin (3) are arranged in the metal base plate frame (1), the pin (3) is in a step shape, the back face of the base island (2) and the step face of the pin (3) are flush, a metal layer (4) is arranged on the step face of the pin (3), a chip (6) is arranged on the back face of the base island (2) in an obverse mode, the surface of the chip (6) and the surface of the metal layer (4) are connected through a metal wire (7), the inner zone of the metal base plate frame (1) is filled with moulding compounds (8), the front face of the moulding compounds (8) is flush with the step face of the pin (3), the back face of the moulding compounds (8) is flush with the back face of the metal base plate frame (1), and anti-oxidation layers (9) are arranged on the front face of the base island (2), the front face and the back face of the pin (3) and the front face and the back face of the metal base plate frame (1). The structure has the advantages that the problem that an object cannot be buried into plate thickness of a traditional metal lead frame, so that the function and the application performance of the metal lead frame are limited can be solved.

Description

technical field [0001] The invention relates to a structure and a process method of a front-mounted flat leg structure and a process method of a metal frame subtractively embedded in a metal frame after secondary etching, and belongs to the technical field of semiconductor packaging. Background technique [0002] There are two main types of conventional four-sided flat leadless metal leadframe structures: [0003] One is the four-sided flat no-lead package (QFN) lead frame. The lead frame of this structure is composed of a copper metal frame and a high temperature resistant adhesive film (such as Figure 19 shown); [0004] One is the pre-encapsulated quad flat no-leads (PQFN) leadframe, the leadframe structure of this structure includes the lead and the base island, and the etched area between the lead and the base island is filled with plastic encapsulant (such as Figure 20 shown). [0005] The above conventional metal lead frame has the following disadvantages: [000...

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to overcome the above-mentioned disadvantages, and provide a structure and a process method of a substraction-embedded chip front-mounted flat leg structure and a process method after the second etching first and then plating the metal frame, which can solve the problem that the traditional metal lead frame lacks system functions

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