Metal frame subtractive embedded chip structure and process method

Abstract

The invention relates to a one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged flat foot structure and a technological method. The one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged flat foot structure is characterized in that a metal substrate frame is included, a paddle and pins are arranged in the metal substrate frame, the front face of the paddle and the front faces of the pins are aligned with the front face of the metal substrate frame, the back faces of the pins are aligned with the back face of the metal substrate frame, the back face of the paddle is aligned with the step faces of the pins, metal layers are arranged on the step faces of the pins, a chip is arranged on the back face of the paddle through conducting or non-conducting adhesion substances, the front face of the chip is connected with the surfaces of the metal layers on the step faces of the pins through metal wires, plastic packaging materials wrap the paddle, the pins, the chip and the metal wires, the plastic packaging materials are aligned with the upper surface and the lower surface of the metal substrate frame, and anti oxidation layers are plated on or organic solderability preservative (OSP) wraps the front face of the paddle, the front faces and the back faces of the pins and the surface of the metal substrate frame. The one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged flat foot structure has the advantages of being capable of solving the problem that the function and the application of a metal wire frame are restricted due to the fact that objects cannot be buried in the thickness of the traditional metal wire frame.

Description

technical field [0001] The invention relates to a structure and a process method of first etching and then plating a metal frame subtraction embedded chip front mounting flat foot. It belongs to the technical field of semiconductor packaging. Background technique [0002] There are two main types of conventional four-sided flat leadless metal leadframe structures: [0003] One is the four-sided flat no-lead package (QFN) lead frame. The lead frame of this structure is composed of a copper metal frame and a high temperature resistant adhesive film (such as Figure 15 shown). [0004] One is the pre-encapsulated quad flat no-leads (pQFN) leadframe, the leadframe structure of this structure includes the lead and the base island, and the etched area between the lead and the base island is filled with plastic encapsulant (such as Figure 16 shown). [0005] The above conventional metal lead frame has the following disadvantages: [0006] 1. The traditional metal lead frame, a...

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a kind of first etch first and then plate metal frame subtraction buried chip front mounting flat leg structure and process method, which can solve the problem of traditional metal Problems with lack of system functionality in leadframes

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