Primary plating-prior-to-etching metal frame subtraction imbedded chip flip plat pin structure and process method

Abstract

The invention relates to a primary plating-prior-to-etching metal frame subtraction imbedded chip flip plat pin structure and a process method. The primary plating-prior-to-etching metal frame subtraction imbedded chip flip plat pin structure is characterized in that the structure comprises a metal base frame; the metal base frame is internally provided with base islands and pins; the back surface of each base island and the step surface of each pin are invertedly provided with a chip through bottom filling glue; the peripheral areas of the base islands, the areas between the base islands and the pins, the areas between the pins, the areas above the base islands and the pins, the areas under the base islands and the pins and the outer sides of the chips are wrapped with plastic packaging materials; and the front surface of the base island, the front surface and the back surface of each pin as well as the surface of the metal substrate fame are plated with an anti-oxidation layer or a coated antioxidant (OSP), wherein the plastic packaging materials are flush with the anti-oxidation layers or coated antioxidants (OSP) on the upper and lower surfaces of the metal substrate fame. The beneficial effect of the structure and method is that: the problem that the function and the application performance of a conventional metal lead frame are limited since an object cannot be imbedded in the metal lead frame of such plate thickness is solved.

Description

technical field [0001] The invention relates to a metal frame subtractive embedded chip flip-chip flat leg structure and a process method after plating first and then etching. It belongs to the technical field of semiconductor packaging. Background technique [0002] There are two main types of conventional four-sided flat leadless metal leadframe structures: [0003] One is the four-sided flat no-lead package (QFN) lead frame. The lead frame of this structure is composed of a copper metal frame and a high temperature resistant adhesive film (such as Figure 13 shown). [0004] One is the pre-encapsulated quad flat no-leads (pQFN) leadframe, the leadframe structure of this structure includes the lead and the base island, and the etched area between the lead and the base island is filled with plastic encapsulant (such as Figure 14 shown). [0005] The above conventional metal lead frame has the following disadvantages: [0006] 1. The traditional metal lead frame, as the...

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Problems solved by technology

[0009]The object of the present invention is to overcome above-mentioned deficiency, provide a kind of metal frame subtractive buried chip flip-chip flat leg structure and its method after plating first, and it can solve the problem of traditional Lack of System Functionality in Metal Leadframes

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