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One-time plating first and then etching metal frame subtractive buried chip front-mount bump structure and process method

A technique of plating first, then etching, and bump structure, which is applied to electrical components, electrical solid devices, circuits, etc., can solve the problems of lack of system functions in metal lead frames, achieve the effects of improving heat dissipation, avoiding signal transmission, and reducing costs

Active Publication Date: 2016-03-30
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a bump structure and method for one-time metal frame subtraction embedded chip mounting after plating, which can solve the problem of lack of system functions in traditional metal lead frames

Method used

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  • One-time plating first and then etching metal frame subtractive buried chip front-mount bump structure and process method
  • One-time plating first and then etching metal frame subtractive buried chip front-mount bump structure and process method
  • One-time plating first and then etching metal frame subtractive buried chip front-mount bump structure and process method

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Embodiment Construction

[0071] The process method of the present invention, which is firstly plated and then etched metal frame subtractive method to embed the bump structure of the chip, is as follows:

[0072] Step 1. Take the metal substrate

[0073] see figure 1 , take a piece of metal substrate with appropriate thickness, the material of this plate is mainly metal material, and the material of metal material can be copper, iron, galvanized, stainless steel, aluminum or metal that can achieve conductive function Material or non-all-metal material, etc., the choice of thickness can be selected according to product characteristics.

[0074] Step 2. Paste photoresist film

[0075] see figure 2 , A photoresist film that can be exposed and developed is pasted on the front and back of the metal substrate to protect the subsequent etching process. The photoresist film can be a dry photoresist film or a wet photoresist film.

[0076] Step 3. Remove part of the photoresist film from the surface of t...

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Abstract

The invention relates to a primary plating-prior-to-etching metal frame subtraction imbedded chip normal-installation bump structure and a process method. The structure is characterized in that the structure comprises a metal base frame; the metal base frame is internally provided with base islands and pins; the pins are in step shapes; the front surface of each base island and the front surface of each pin are flush with the front surface of the metal substrate frame; the back surface of each pin is flush with the back surface of the metal substrate frame; the step surface of each pin is provided with a metal layer; the back surface of each base island is provided with a chip through a conductive or non-conductive bonding material; the front surface of the chip is connected with the surface of the metal layer through a metal line; the front surface of the base island, the front surface and the back surface of each pin as well as the surface of the metal substrate frame are plated with an anti-oxidation layer or a coated antioxidant (OSP), wherein plastic packaging materials are flush with the anti-oxidation layers or the coated antioxidants (OSP) on the upper and lower surfaces of the metal substrate frame; and the back surface of each pin is provided with a metal ball. The beneficial effect of the structure and method is that: the problem that the function and the application performance of a conventional metal lead frame are limited since an object cannot be imbedded in the metal lead frame of such plate thickness is solved.

Description

technical field [0001] The invention relates to a first-plating-and-etch-then-etching metal frame subtraction-embedded chip front-mount bump structure and a process method thereof. It belongs to the technical field of semiconductor packaging. Background technique [0002] There are two main types of conventional four-sided flat leadless metal leadframe structures: [0003] One is the four-sided flat no-lead package (QFN) lead frame. The lead frame of this structure is composed of a copper metal frame and a high temperature resistant adhesive film (such as Figure 19 shown). [0004] One is the pre-encapsulated quad flat no-leads (pQFN) leadframe, the leadframe structure of this structure includes the lead and the base island, and the etched area between the lead and the base island is filled with plastic encapsulant (such as Figure 20 shown). [0005] The above conventional metal lead frame has the following disadvantages: [0006] 1. The traditional metal lead frame, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L23/31H01L21/56H01L21/60
CPCH01L2224/48091H01L2224/73265H01L2224/92247
Inventor 王新潮梁志忠章春燕
Owner JCET GROUP CO LTD
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