Secondary plating-prior-to-etching metal frame subtraction imbedded chip flip bump structure and process method

Abstract

The invention relates to a secondary plating-prior-to-etching metal frame subtraction imbedded chip flip bump structure and a process method. The structure comprises a metal substrate fame (1). The metal substrate fame (1) is internally provided with base islands (2) and pins (3). The pins (3) are in step shapes. The back surface of each base island (2) is flush with the step surface of each pin (3). The back surface of each base island (2) and the step surface of each pin (3) are invertedly equipped with a chip (6) through bottom filling glue (5). The metal substrate fame (1) is internally filled with plastic packaging material (7). The front surface of the plastic packaging material (7) is flush with the step surface of the pin (3). The back surface of the plastic packaging material (7) is flush with the back surface of the metal substrate fame (1). The front surface of the base island (2), the front surface and the back surface of each pin (3) as well as the front surface and the back surface of the metal substrate fame (1) are provided with an anti-oxidation layer (4). The back surface of each pin (3) is provided with a metal ball (9). The beneficial effect of the structure and method is that: the problem that the function and the application performance of a conventional metal lead frame are limited since an object cannot be imbedded in the metal lead frame with such plate thickness is solved.

Description

technical field [0001] The invention relates to a flip-chip bump structure and a process method of a metal frame subtractive embedded chip after secondary plating, and belongs to the technical field of semiconductor packaging. Background technique [0002] There are two main types of conventional four-sided flat leadless metal leadframe structures: [0003] One is the four-sided flat no-lead package (QFN) lead frame. The lead frame of this structure is composed of a copper metal frame and a high temperature resistant adhesive film (such as Figure 18 shown); [0004] One is the pre-encapsulated quad flat no-leads (PQFN) leadframe, the leadframe structure of this structure includes the lead and the base island, and the etched area between the lead and the base island is filled with plastic encapsulant (such as Figure 19 shown). [0005] The above conventional metal lead frame has the following disadvantages: [0006] 1. The traditional metal lead frame, as the packaging c...

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Problems solved by technology

[0009] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a flip-chip bump structure and process method of the metal frame subtractive method of secondary plating first and then etching the metal frame, which can solve the problem of lack of system functions in the traditional metal lead frame

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