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Packaging-prior-to-etching chip-flipped type three-dimensional system-level metal circuit board structure and process method thereof

A technology of etching first and then sealing metal lines, which is applied in the direction of circuits, electrical components, and electrical solid devices, and can solve problems that limit the functionality and application performance of metal lead frames

Active Publication Date: 2013-11-20
江阴芯智联电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a flip-chip three-dimensional system-level metal circuit board structure and process method after etching first and then sealing the chip. application performance

Method used

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  • Packaging-prior-to-etching chip-flipped type three-dimensional system-level metal circuit board structure and process method thereof
  • Packaging-prior-to-etching chip-flipped type three-dimensional system-level metal circuit board structure and process method thereof
  • Packaging-prior-to-etching chip-flipped type three-dimensional system-level metal circuit board structure and process method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0195] Embodiment 1, single-layer circuit single-chip flip-chip single-turn pin

[0196] see Figure 23 , is a structural schematic diagram of Embodiment 1 of the flip-chip three-dimensional system-level metal circuit board structure of the present invention, which includes a metal substrate frame 1, and a base island 2 and pins 3 are arranged in the metal substrate frame 1, The front of the base island 2 and the pin 3 is flip-mounted with a chip 5 through the underfill glue 4, and a conductive pillar 7 is arranged on the front of the pin 3, and the peripheral area of ​​the base island 2, the base island 2 and the pin 3 The area between, the area between pin 3 and pin 3, the area on the base island 2 and the upper part of pin 3, the area on the base island 2 and the lower part of pin 3, and the chip 5 and the conductive pillar 7 are all encapsulated with Molding compound 8, the molding compound 8 is flush with the top of the conductive pillar 7, and the surface of the metal s...

Embodiment 2

[0242] Embodiment 2, multi-turn single-chip flip chip + passive device + electrostatic discharge ring

[0243] see Figure 24 , which is a structural schematic diagram of Embodiment 2 of the flip-chip three-dimensional system-level metal circuit board structure of the present invention. The difference between Embodiment 2 and Embodiment 1 lies in that: the pin 3 has multiple turns, and the lead The passive device 10 is bridged between the pin 3 and the pin 3 through a conductive adhesive substance, and an electrostatic discharge ring 11 is arranged between the base island 2 and the pin 3, and the passive device 10 can be bridged to the lead. Between the front of pin 3 and the front of pin 3.

Embodiment 3

[0244] Embodiment 3, single-turn multi-base island tiling multi-chip flip chip

[0245] see Figure 25 , which is a structural schematic diagram of Embodiment 3 of the flip-chip three-dimensional system-level metal circuit board structure of the present invention, which is etched first and then sealed. The underfill 4 is flip-chip mounted with a plurality of chips 5 .

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Abstract

The invention relates to a packaging-prior-to-etching chip-flipped type three-dimensional system-level metal circuit board structure and a process method thereof. The structure comprises a metal substrate frame, wherein a pad and pins are arranged in the metal substrate frame; chips are flipped on the front surfaces of the pad and the pins; conductive columns are arranged on the front surfaces of the pins; molding compounds are encapsulated in the peripheral area of the pad, the areas between the pad and the pins and between each two pins, the upper areas of the pad and the pins, the lower areas of the pad and the pins, and the external areas of the chips and the conductive columns; and anti-oxidation layers are plated on the surfaces, exposed from the molding compounds, of the metal substrate frame, the pins and the conductive columns. By virtue of the packaging-prior-to-etching chip-flipped type three-dimensional system-level metal circuit board structure and the process method thereof, the problem of limitation of the functionality and application performance of a metal lead frame caused by difficulty in embedding of an object into a conventional metal lead frame can be solved.

Description

technical field [0001] The invention relates to a flip-chip three-dimensional system-level metal circuit board structure and a process method that are etched first and then sealed. It belongs to the technical field of semiconductor packaging. Background technique [0002] The basic manufacturing process methods of traditional metal lead frames are as follows: [0003] 1) Take a metal sheet and use the technology of mechanical upper and lower tool punching to make punching from top to bottom or bottom to top in a longitudinal manner, so that the lead frame can form a base island carrying a chip and signal transmission in the metal sheet The inner pins used are connected to the outer pins of the external PCB, and then some areas of the inner pins and (or) the base island are covered with metal plating to form a lead frame that can actually be used (see Figure 70~Figure 72 ). [0004] 2) Take a metal sheet and use chemical etching technology for exposure, development, window...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/56H01L23/495H01L23/31
CPCH01L23/49517H01L23/49811H01L23/49822H01L21/48H01L21/4821H01L21/4825H01L21/4853H01L21/4857H01L2224/16H01L2224/48091H01L2224/73204H01L2224/73265H01L2924/19107H01L23/3107H01L21/561H01L21/568H01L2224/45147H01L2224/16225H01L2924/19105H01L2924/181H01L2924/00011H01L23/49575H01L23/60H01L25/16H01L25/105H01L25/0655H01L25/0657H01L25/50H01L2225/0651H01L2924/00014H01L2924/00012H01L2924/01005H01L2924/00015H01L2924/00
Inventor 张友海张凯廖小景王亚琴王孙艳
Owner 江阴芯智联电子科技有限公司
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