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Packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and process method thereof

A technology of etching first and then sealing metal lines, which is applied to circuits, semiconductor/solid-state device parts, semiconductor devices, etc., and can solve the problems of limiting the functionality and application performance of metal lead frames

Active Publication Date: 2013-11-20
江阴芯智联电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a three-dimensional system-level metal circuit board with flip-chip bumps etched first and then sealed, and its process method, which can solve the problem that the traditional metal lead frame cannot be embedded in objects and limit the functionality of the metal lead frame and application performance

Method used

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  • Packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and process method thereof
  • Packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and process method thereof
  • Packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and process method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0200] Embodiment 1, single-layer circuit single-chip flip-chip single-turn pin

[0201] see Figure 24 , which is a structural schematic diagram of Embodiment 1 of a flip-chip bump three-dimensional system-level metal circuit board of the present invention, which includes a metal substrate frame 1, and a base island 2 and pins 3 are arranged in the metal substrate frame 1 , the front of the base island 2 and the pin 3 is flip-mounted with a chip 5 through the underfill glue 4, and a conductive pillar 7 is arranged on the front of the pin 3, and the peripheral area of ​​the base island 2, the base island 2 and the pin 3, the area between pin 3 and pin 3, the area above base island 2 and pin 3, the area below base island 2 and pin 3, and the chip 5 and conductive pillar 7 are all encapsulated There is a molding compound 8, which is flush with the top of the conductive pillar 7, and the surface of the metal substrate 1, the base island 2, the pin 3 and the conductive pillar 7 e...

Embodiment 2

[0249] Embodiment 2, multi-turn single-chip flip chip + passive device + electrostatic discharge ring

[0250] see Figure 25 , which is a structural schematic diagram of Embodiment 2 of the flip-chip bump three-dimensional system-level metal circuit board of the present invention. The difference between Embodiment 2 and Embodiment 1 is that the pin 3 has multiple turns, and the The passive device 10 is bridged between the pin 3 and the pin 3 through a conductive adhesive substance, and an electrostatic discharge ring 11 is arranged between the base island 2 and the pin 3, and the passive device 10 can be bridged between the Between Pin 3 Front and Pin 3 Front.

Embodiment 3

[0251] Embodiment 3, single-turn multi-base island tiling multi-chip flip chip

[0252] see Figure 26 , which is a structural schematic diagram of Embodiment 3 of the flip-chip bump three-dimensional system-level metal circuit board of the present invention, which is etched first and then sealed. A plurality of chips 5 are flipped through the underfill glue 4 .

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Abstract

The invention relates to a packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and a process method thereof. The metal circuit board structurally comprises a metal substrate frame, wherein a pad and pins are arranged in the metal substrate frame; chips are flipped on the front surfaces of the pad and the pins; conductive columns are arranged on the front surfaces of the pins; molding compounds are encapsulated in the peripheral area of the pad, the areas between the pad and the pins and between each two pins, the upper areas of the pad and the pins, the lower areas of the pad and the pins, and the external areas of the chips and the conductive columns; anti-oxidation layers are plated on the surfaces, exposed from the molding compounds, of the metal substrate frame, the pins and the conductive columns; and metal balls are arranged on the tops of the conductive columns. By virtue of the packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and the process method thereof, the problem of limitation of the functionality and application performance of a metal lead frame caused by difficulty in embedding of an object into a conventional metal lead frame can be solved.

Description

technical field [0001] The invention relates to a three-dimensional system-level metal circuit board with flip chip bumps etched first and then sealed, and a process method. It belongs to the technical field of semiconductor packaging. Background technique [0002] The basic manufacturing process methods of traditional metal lead frames are as follows: [0003] 1) Take a metal sheet and use the technology of mechanical upper and lower tool punching to make punching from top to bottom or bottom to top in a longitudinal manner, so that the lead frame can form a base island carrying a chip and signal transmission in the metal sheet The inner pins used are connected to the outer pins of the external PCB, and then some areas of the inner pins and (or) the base island are covered with metal plating to form a lead frame that can actually be used (see Figure 72~Figure 74 ). [0004] 2) Take a metal sheet and use chemical etching technology for exposure, development, window openin...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/56H01L23/495H01L23/31
CPCH01L2924/19107H01L2224/32145H01L2224/48091H01L2224/73204H01L2224/73265H01L2924/00014
Inventor 张友海张凯廖小景王亚琴王孙艳
Owner 江阴芯智联电子科技有限公司
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