Three-dimensional system-level metal circuit board structure and process method for passive devices after sealing and etching

Abstract

The invention relates to a three-dimensional system-level metal circuit board structure and process method for sealing first and then etching passive devices. The structure includes a metal substrate frame (1), and pins (3) are arranged on the front of the metal substrate frame (1) , the front of the pin (3) is provided with a conductive pillar (4), and a passive device (5) is installed between the pin (3) and the pin (3) through a conductive or non-conductive bonding substance (11) ), the peripheral areas of the pins (3), conductive pillars (4) and passive components (5) are encapsulated with a molding compound (7), and the molding compound (7) is flush with the top of the conductive pillars (4), An anti-oxidation layer (6) is provided on the surface of the metal substrate frame (1), pins (3) and conductive pillars (4) exposed from the molding compound (7). A three-dimensional system-level metal circuit board structure and process method for sealing first and etching later passive devices, which can solve the problem that the traditional metal lead frame cannot be embedded in objects and limit the functionality and application performance of the metal lead frame.

Description

technical field [0001] The invention relates to a three-dimensional system-level metal circuit board structure and process method of sealing first and then etching passive devices, belonging to the technical field of semiconductor packaging. Background technique [0002] The basic manufacturing process methods of traditional metal lead frames are as follows: [0003] 1. Take a metal sheet and use the technology of mechanical upper and lower tool punching to make punching from top to bottom or bottom to top in a longitudinal manner (see Figure 85 ), so that the lead frame can be formed in the metal sheet with the base island carrying the chip and the inner pins for signal transmission and the outer pins connected to the external PCB, and then the inner pins and / or some areas of the base island Metallization coating to form a real usable leadframe (see Figure 86 , 87 ); [0004] 2. Take a metal sheet and use chemical etching technology for exposure, development, window op...

AI Technical Summary

Problems solved by technology

[0016] The purpose of the present invention is to overcome the above-mentioned deficiencies, and provide a three-dimensional system-level metal circuit board structure and process method for passive devices that are sealed first and etched later. application performance

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