Packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and process method thereof

Abstract

The invention relates to a packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and a process method thereof. The metal circuit board structurally comprises a metal substrate frame (1), wherein pins (3) are arranged on the front surface of the metal substrate frame (1); conductive columns (4) are arranged on the front surfaces of the pins (3); a chip (5) is flipped between each two pins (3) through a bottom filling adhesive; molding compounds (7) are encapsulated in the peripheral areas of the pins (3), the conductive columns (4) and the chips (5) and are level with the tops of the conductive columns (4); anti-oxidation layers (6) are arranged on the surfaces, exposed from the molding compounds (7), of the metal substrate frame (1), the pins (3) and the conductive columns (4); and metal balls (17) are arranged on the tops of the conductive columns (4). By virtue of the packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and the process method thereof, the problem of limitation of the functionality and application performance of a metal lead frame caused by difficulty in embedding of an object into a conventional metal lead frame can be solved.

Description

technical field [0001] The invention relates to a three-dimensional system-level metal circuit board with chip flip-chip bumps sealed first and etched later and a process method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] The basic manufacturing process methods of traditional metal lead frames are as follows: [0003] 1. Take a metal sheet and use the technology of mechanical upper and lower tool punching to make punching from top to bottom or bottom to top in a longitudinal manner (see Figure 90 ), so that the lead frame can be formed in the metal sheet with the base island carrying the chip and the inner pins for signal transmission and the outer pins connected to the external PCB, and then the inner pins and / or some areas of the base island Metallization coating to form a real usable leadframe (see Figure 91 , 92 ); [0004] 2. Take a metal sheet and use chemical etching technology for exposure, development, win...

AI Technical Summary

Problems solved by technology

[0016] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a three-dimensional system-level metal circuit board and a process method for sealing first and then etching chip flip-chip bumps, which can solve the problem that traditional metal lead frames cannot be embedded in objects and limit the functionality of metal lead frames and application performance

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