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Etch first and then seal chip flip-chip three-dimensional system-level metal circuit board structure and process method

It is a technique of etching first and sealing later, which is applied in the direction of circuits, electrical components, electrical solid devices, etc., and can solve the problems of limiting the functionality and application performance of metal lead frames.

Active Publication Date: 2016-06-29
江阴芯智联电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a flip-chip three-dimensional system-level metal circuit board structure and process method after etching first and then sealing the chip. application performance

Method used

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  • Etch first and then seal chip flip-chip three-dimensional system-level metal circuit board structure and process method
  • Etch first and then seal chip flip-chip three-dimensional system-level metal circuit board structure and process method
  • Etch first and then seal chip flip-chip three-dimensional system-level metal circuit board structure and process method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0195] Embodiment 1, single-layer circuit single-chip flip-chip single-turn pin

[0196] see Figure 23 , is a structural schematic diagram of Embodiment 1 of the flip-chip three-dimensional system-level metal circuit board structure of the present invention, which includes a metal substrate frame 1, and a base island 2 and pins 3 are arranged in the metal substrate frame 1, The front of the base island 2 and the pin 3 is flip-mounted with a chip 5 through the underfill glue 4, and a conductive pillar 7 is arranged on the front of the pin 3, and the peripheral area of ​​the base island 2, the base island 2 and the pin 3 The area between, the area between pin 3 and pin 3, the area on the base island 2 and the upper part of pin 3, the area on the base island 2 and the lower part of pin 3, and the chip 5 and the conductive pillar 7 are all encapsulated with Molding compound 8, the molding compound 8 is flush with the top of the conductive pillar 7, and the surface of the metal s...

Embodiment 2

[0242] Embodiment 2, multi-turn single-chip flip chip + passive device + electrostatic discharge ring

[0243] see Figure 24 , which is a structural schematic diagram of Embodiment 2 of the flip-chip three-dimensional system-level metal circuit board structure of the present invention. The difference between Embodiment 2 and Embodiment 1 lies in that: the pin 3 has multiple turns, and the lead The passive device 10 is bridged between the pin 3 and the pin 3 through a conductive adhesive substance, and an electrostatic discharge ring 11 is arranged between the base island 2 and the pin 3, and the passive device 10 can be bridged to the lead. Between the front of pin 3 and the front of pin 3.

Embodiment 3

[0244] Embodiment 3, single-turn multi-base island tiling multi-chip flip chip

[0245] see Figure 25 , which is a structural schematic diagram of Embodiment 3 of the flip-chip three-dimensional system-level metal circuit board structure of the present invention, which is etched first and then sealed. The underfill 4 is flip-chip mounted with a plurality of chips 5 .

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Abstract

The invention relates to a flip-chip three-dimensional system-level metal circuit board structure and a process method thereof. The structure includes a metal substrate frame, and base islands and pins are arranged in the metal substrate frame. Chips are flipped on the front of the base island and the pins, conductive pillars are arranged on the front of the pins, the area around the base island, the area between the base island and the pins, and the area between the pins , the base island and the upper part of the pin, the base island and the lower part of the pin, and the outside of the chip and the conductive pillar are all encapsulated with plastic compound, and the surface of the metal substrate frame, pin and conductive pillar exposed to the plastic compound is plated with Antioxidant layer. The invention can solve the problem that the traditional metal lead frame cannot be embedded in objects and limits the functionality and application performance of the metal lead frame.

Description

technical field [0001] The invention relates to a flip-chip three-dimensional system-level metal circuit board structure and a process method that are etched first and then sealed. It belongs to the technical field of semiconductor packaging. Background technique [0002] The basic manufacturing process methods of traditional metal lead frames are as follows: [0003] 1) Take a metal sheet and use the technology of mechanical upper and lower tool punching to make punching from top to bottom or bottom to top in a longitudinal manner, so that the lead frame can form a base island carrying a chip and signal transmission in the metal sheet The inner pins used are connected to the outer pins of the external PCB, and then the inner pins and (or) some areas of the base island are covered with metal plating to form a lead frame that can actually be used (see Figure 70~Figure 72 ). [0004] 2) Take a metal sheet and use chemical etching technology to expose, develop, open windows,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L21/56H01L23/495H01L23/31
CPCH01L23/49517H01L23/49811H01L23/49822H01L21/48H01L21/4821H01L21/4825H01L21/4853H01L21/4857H01L2224/16H01L2224/48091H01L2224/73204H01L2224/73265H01L2924/19107H01L23/3107H01L21/561H01L21/568H01L2224/45147H01L2224/16225H01L2924/19105H01L2924/181H01L2924/00011H01L23/49575H01L23/60H01L25/16H01L25/105H01L25/0655H01L25/0657H01L25/50H01L2225/0651H01L2924/00014H01L2924/00012H01L2924/01005H01L2924/00015H01L2924/00
Inventor 张友海张凯廖小景王亚琴王孙艳
Owner 江阴芯智联电子科技有限公司
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