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Substrate structure and method for attaching and peeling off flexible substrate
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A flexible substrate and substrate technology, applied in the field of substrate manufacturing, can solve the problems of difficult removal, high cost of coating raw materials and peeling methods, and easy pollution, and achieve the effect of low cost
Active Publication Date: 2017-11-24
BAZHOU YUNGU ELECTRONICS TECH CO LTD
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Problems solved by technology
[0004] However, the above method has the following defects: 1. The adhesive has good fluidity and is easy to apply to the back of the rigid substrate or the border area. After the flexible substrate is attached, it is easy to cause pollution, and it is easy to have glue residue after peeling off, which is not easy to remove.
Second, the cost of coating raw materials and stripping methods used for direct coating on rigid substrates is relatively high
Method used
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Embodiment 1
[0045] The entire substrate is a rigid substrate and consists of three parts:
[0046] The flexible substrate 11 is a PEN film.
[0047] The bonding layer 12 includes: the low bonding strength layer 121 adopts a silicon-containing adhesive, such as silicone resin; the substrate 122 adopts fiber fabric or fiber paper, such as using PI materials; adhesive;
[0048] The rigid substrate 13 is a glass substrate.
[0049] The overall substrate can be integrated into the existing glass substrate manufacturing process. After the device is manufactured, the low bonding strength layer of the bonding layer 12 is used Figure 2B The flexible substrate 11 is mechanically peeled off in a manner to obtain a flexible device.
Embodiment 2
[0051] The entire substrate is a rigid substrate and consists of three parts:
[0052] The flexible substrate 11 is a PI film.
[0053] The bonding layer 12 includes: the low bonding strength layer 121 adopts a silicon-containing adhesive, such as silicone resin; the base material 122 adopts fiber fabric or fiber paper, such as using PI materials; adhesive.
[0054] The rigid substrate 13 is a glass substrate.
[0055] After the device is finished, adopt from the low bonding strength layer of bonding layer 12 Figure 2AThe flexible substrate 11 is peeled off to obtain a flexible device.
Embodiment 3
[0057] The entire substrate is a rigid substrate and consists of three parts:
[0058] The flexible substrate 11 is ultra-thin glass.
[0059] The bonding layer 12 includes: the low bonding strength layer 121 adopts a silicon-containing adhesive, such as silicone rubber; the base material 122 adopts fiber fabric or fiber paper, such as using PI materials; Ester adhesives;
[0060] The rigid substrate 13 is a glass substrate.
[0061] The overall substrate can be integrated into the existing glass substrate manufacturing process. After the device is manufactured, the low bonding strength layer of the bonding layer 12 is used Figure 2C The flexible substrate 11 is mechanically peeled off in a manner to obtain a flexible device.
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Abstract
The invention discloses a substrate structure and a method for attaching and peeling off a flexible substrate thereof. The substrate structure comprises a flexible substrate (11), a rigid substrate (13) and an adhesive layer (12); the adhesive layer (12) Sandwiched between the flexible substrate (11) and the rigid substrate (13); the adhesive layer (12) has low bonding strength on the side in contact with the flexible substrate (11); the adhesive layer (12) and The contact side of the rigid substrate (13) has high bonding strength. With the substrate structure, after the device is manufactured, the flexible substrate can be peeled off from the low bonding strength layer to obtain a flexible device, which has the advantages of easy cleaning, no pollution, simple process and low cost.
Description
technical field [0001] The invention relates to substrate manufacturing technology, in particular to a substrate structure and a method for attaching and peeling off a flexible substrate. Background technique [0002] The rollable flexible substrate used in flexible devices can realize roll-to-roll (roll to roll) preparation, but there are some technical problems at present. Most of the existing flexible device manufacturing methods are to fix the flexible substrate to the rigid substrate. After the fabrication is completed, the flexible substrate is peeled off from the rigid substrate to obtain a flexible device. [0003] At present, there are many ways to fix the flexible substrate to the rigid substrate, which can be roughly divided into two categories: first, the flexible substrate is attached to the rigid substrate with an adhesive, and the device is peeled off after the device is manufactured. Second, directly coat the raw material of the flexible substrate on the rig...
Claims
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Application Information
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