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Microfluidic device

A microfluidic device and microfluidic technology, applied in lamination devices, flow control, transportation and packaging, etc., can solve problems such as no specific structure

Inactive Publication Date: 2014-04-16
SONY DADC AUSTRIA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Layer 4 is perforated to carry the microfluidic circuit structure consisting of channels, mixing chambers, etc. However, layers 2 and 6 are basically structurally unstructured except for layer 6 with inlet ports and outlets for external fluid communication

Method used

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  • Microfluidic device
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Examples

Experimental program
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Embodiment Construction

[0050] figure 1 is a schematic cross-section of a part of the microfluidic device 2 according to the first embodiment of the present invention.

[0051] The part shown shows a first layer 2, a second layer 4 and a third layer 6, each of which is made of a plastic material such as a polymer, particularly as listed below in the section describing the injection molding process one of the polymers. The first layer 12 has a top surface 21 and a bottom surface 23 . The second layer 4 has a top face 41 and a bottom face 43 . The third layer 6 has a top face 61 and a bottom face 63 .

[0052] For example in the case of polymer layers, the bottom surface 23 of the first layer 2 is bonded to the top surface 41 of the second layer 4 by a solvent vapor bonding process. The laterally extending microfluidic channel 12 is shown on the first layer 2 and the second layer 4 by the surface structure of one or both of the first layer 2 and the second layer 4 (the surface structure is only the...

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PUM

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Abstract

A microfluidic device comprising in sequence first, second and third layers of plastics materials. A microfluidic circuit including a laterally extending microfluidic channel is formed at the interface between the first and second layers by surface structure in one or both of the first and second layers. A via is formed in the third layer for supplying or removing fluid to or from the microfluidic circuit. A conduit is formed in the second layer to provide fluid communication between the microfluidic channel and the via. A weld is formed at the interface between the second and third layers in a continuous closed path around the via and forms a fluid-tight seal for fluid flow between the via and the microfluidic circuit.

Description

technical field [0001] The present invention relates to microfluidic devices and methods of manufacture and inspection thereof. Background technique [0002] Microfluidic circuits are generally fabricated as planar structures from two substrates bonded together and arranged in a carrier. A carrier is sometimes called a caddy. In the case of polymeric substrates, solvent vapor bonding can be used to bond the substrates. For the glass substrate, an appropriate bonding agent can be used. Microfluidic circuit elements such as channels and mixing chambers are formed at the interface between the substrates through the surface structure of one or both substrates. In addition, to provide fluid to and remove fluid from the circuit, one substrate has through holes to provide external access that align with corresponding through holes in the carrier. Fluid seals are required around these external access points to prevent fluid leakage or pressure loss between the carrier and adjace...

Claims

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Application Information

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IPC IPC(8): B01L3/00G01N21/88
CPCB32B37/00B01L3/502707B29C65/16G05D7/0694B01L2300/0887B29C65/1616B29C65/1638B29C65/1654B29C66/1122B29C66/24221B29C66/54B29L2031/756B29C66/836B29C66/863B29C66/65B29C66/73921B29K2995/0025B29K2995/0027B29C66/71B29C66/72326Y10T137/0402Y10T137/8593B29K2023/06B29K2023/12B29K2023/38B29K2025/06B29K2025/08B29K2033/12B29K2069/00B29K2077/00B29K2079/08
Inventor 迈克尔·平格特达里奥·博洛维斯阿尔弗雷多·帕里斯
Owner SONY DADC AUSTRIA