Multi-chip packaging body and packaging method

Abstract

The invention provides a multi-chip packaging body and a packaging method. The multi-chip packaging body comprises a first function chip and a controller chip. The first function chip and the controller chip are arranged on a chip base of a lead frame respectively. The first function chip is welded on the chip base through tin welding powder and is connected to a pin of the lead frame through a chip welding wire. The first function chip is connected with and transmits dynamic signals to the controller chip so that the controller chip can determine working state and give real-time protection. The multi-chip packaging body and the packaging method have the advantages that the functional chip and the controller chip are arranged on the same lead frame, horizontally achieving multi-chip packaging, saving internal space of electronic products and achieving downsizing and lightweight of electronic products. A plurality of chips integrated in the multi-chip package structure can achieve different functions respectively, so that multi-function and high integration of electronic products are achieved. Besides, the chip is connected with the pin through the chip welding wire in an electrical mode, which is more suitable for high-power devices.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a multi-chip package and a packaging method thereof. Background technique [0002] With the development of semiconductor technology, integrated circuits have become multi-functional and highly integrated, requiring the package to be able to realize multiple different functions at the same time. However, due to the small number of chips packaged in the traditional package, the functions that can be realized are very single, and cannot meet the new needs of customers in the electronic market. Only a variety of different packages can be used to realize the corresponding single function respectively, resulting in the inability to realize the miniaturization and portability of electronic terminal products. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a multi-chip package and its packaging method, which ...

AI Technical Summary

Problems solved by technology

However, due to the small number of packaged chips in the traditional package, the functions that can be realized are very single, which cannot meet the new needs of customers in the electronic market.

Only a variety of different packages can be used to realize the corresponding single function, which leads to the inability to realize the miniaturization and portability of electronic terminal products

Images