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Elastic mounting structure for light-emitting diode (LED) lamp

An LED light board, flexible installation technology, applied in lighting devices, lighting device parts, lighting device cooling/heating devices, etc. The effect of a small damage rate

Inactive Publication Date: 2014-04-23
SHANGHAI XINFENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the heat dissipation requires close contact, the height of the heat dissipation boss is slightly higher than the thickness of the lamp board, but the strength of the LED pad is relatively fixed. Due to the error in the processing of the heat dissipation boss, there will be contact when it is fixed by screws evenly distributed around it. Insufficient or open LED pads, causing damage

Method used

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  • Elastic mounting structure for light-emitting diode (LED) lamp
  • Elastic mounting structure for light-emitting diode (LED) lamp
  • Elastic mounting structure for light-emitting diode (LED) lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0017] A flexible mounting structure for LED lamp boards, including LED lamps 1, lamp boards 2, and radiators 3. The lamp boards 2 are fixed on the radiators 3. There is a rectangular hollow structure 4 in the middle of the lamp boards 2. On the radiator 3, there is a The hollow structure 4 of the board 2 matches the heat dissipation boss 5, and the LED lamp 1 is fixed on the lamp board 2, and directly contacts with the heat dissipation boss 5. There are solder pads on both sides of the hollow structure 4, which are connected to the positive and negative electrodes of the LED lamp 1 .

[0018] Use the PCB substrate to make the light board 2, distribute four screw holes 6 evenly at the four corners of the light board 2, fix the light board 2 to the radiator 3 with screws, and make an arc-shaped next to each screw hole 6 The proc...

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Abstract

An elastic mounting structure for an LED lamp comprises the LED lamp, a lamp panel and a radiator. The lamp panel is fixed on the radiator, a rectangular structure is arranged in the middle of the lamp pane, a radiation boss matched with the hollow structure of the lamp panel is arranged on the radiator, and the LED lamp is fixed on the lamp panel and in direct contact with the radiation boss. Four screw holes are distributed uniformly in the four corners of the lamp panel, a cambered process groove is manufactured nearby each cambered screw hole, cambers of the process grooves are bent towards the LED lamp, and the four process grooves are independent relatively. By the aid of the process grooves, air heat convection channels are provided in the whole lamp, the lamp panel portion except the process grooves has enough deformation space, and accordingly, the damage rate during mounting can be reduced.

Description

technical field [0001] The invention relates to an installation structure, in particular to an elastic installation structure of an LED lamp board. Background technique [0002] In order to prolong the life of LED lighting products, a rectangular hollow structure is set in the middle of the light board, and a heat dissipation boss matching the hollow structure of the light board is set on the radiator. The LED light is fixed on the light board and directly connected to the Contact with the heat dissipation boss, the size of the heat dissipation boss is the same as the heat conduction surface at the bottom of the LED lamp, so that the bottom of the LED lamp can be directly in contact with the heat sink, reducing the heat conduction link, and the heat generated by the LED chip is directly transferred to the heat sink, improving heat radiation. [0003] Since the heat dissipation requires close contact, the height of the heat dissipation boss is slightly higher than the thickn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V17/12F21V29/00F21Y101/02F21V29/74F21Y115/10
Inventor 陈赟赟李楠李海东杨勤忠
Owner SHANGHAI XINFENG ELECTRONICS
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