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Low Power and Small Form Factor Infrared Imaging

An infrared imaging system and infrared sensor technology, applied in image communication, equipment with functional cameras, TV, etc., can solve problems such as dependence, complex implementation, and unsatisfactory technical effects

Active Publication Date: 2019-01-18
FLIR SYST INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such implementations are often complex and can be relatively inefficient
[0009] Additionally, during operation at conventional voltages and currents, infrared imaging devices may be subject to significant self-heating, which may cause various undesirable thermal effects
However, conventional techniques for reducing this effect are also less effective and may rely on active cooling or other measures that increase the cost and complexity of infrared imaging devices

Method used

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  • Low Power and Small Form Factor Infrared Imaging
  • Low Power and Small Form Factor Infrared Imaging
  • Low Power and Small Form Factor Infrared Imaging

Examples

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Embodiment Construction

[0031] figure 1 An infrared imaging module 100 (eg, an infrared camera or an infrared imaging device) configured to be implemented in a host device 102 according to an embodiment of the present disclosure is shown. In one or more embodiments, the infrared imaging module 100 with a small form factor may be implemented according to wafer level packaging technology or other packaging technology.

[0032] In one embodiment, infrared imaging module 100 may be configured to be implemented in a small portable host device 102, such as a mobile phone, tablet computer device, laptop computer device, personal digital assistant, visible light camera, music player, or any other suitable mobile device. In this regard, infrared imaging module 100 may be used to provide infrared imaging functionality to host device 102 . For example, infrared imaging module 100 can be configured to capture, process, and / or manage infrared images and provide the infrared images to host device 102, which can ...

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Abstract

Various techniques for implementing an infrared imaging system are provided. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensor. The bias voltage is selected from a range of about 0.2v to about 0.7v. The FPA also includes a readout integrated circuit (ROIC) adapted to provide signals from the infrared sensor corresponding to captured image frames. Other embodiments are also provided.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Provisional Patent Application No. 61 / 656,889, filed June 7, 2012, entitled "LOW POWER ANDSMALL FORM FACTOR INFRARED IMAGING," which is hereby incorporated by reference in its entirety . [0003] This application also claims the benefit of U.S. Provisional Patent Application No. 61 / 545,056, filed October 7, 2011, entitled "NON-UNIFORMITY CORRECTION TECHNIQUES FOR INFRARED IMAGING DEVICES," which is incorporated by reference in its entirety merged here. [0004] This application also claims the benefit of US Provisional Patent Application No. 61 / 495,873, filed June 10, 2011, entitled "INFRARED CAMERA PACKAGING SYSTEMS AND METHODS," which is hereby incorporated by reference in its entirety. [0005] This application also claims the benefit of US Provisional Patent Application No. 61 / 495,879, filed June 10, 2011, and entitled "INFRAREDCAMERA SYSTEM ARCHITECTURES," which is hereby ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/33H04M1/725
CPCH04N23/57H04N25/78H04N25/21H04N25/673H04N23/51H04N25/60H04N25/75H04N5/33H04M1/725H04M2250/52
Inventor M·纳斯迈耶E·A·库尔特N·霍根斯特恩T·R·赫尔特K·斯特兰德玛P·布朗热B·夏普
Owner FLIR SYST INC