Unlock instant, AI-driven research and patent intelligence for your innovation.

Chip electrode connection structure of led components

A technology for LED chips and LED components, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of complex process, high cost, fragile structure, etc., and achieve the effect of simple process, low cost and simple structure

Active Publication Date: 2016-10-05
FUJIAN YDJ LIGHT
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The connecting wires in the above methods 1, 2, and 4 generally use thin gold wires, which are costly, fragile in structure and easy to break, and the process is complicated; in method 3, it is necessary to make a substrate circuit connecting the electrodes between the LDE chips, and a special inverted circuit must be made. Mounting LED chips and supporting pads on the substrate require special fabrication, which is complex and costly

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip electrode connection structure of led components
  • Chip electrode connection structure of led components
  • Chip electrode connection structure of led components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as Figure 2 to Figure 4 Shown is the chip electrode connection structure of the LED component described in the first embodiment of the present invention, a chip electrode connection structure of the LED component, including a plurality of LED chips and LED component power electrodes 23, the multiple The LED chips are divided into two groups. The first group of LED chips 21 includes 5 LED chips whose positive and negative electrodes are spaced apart in the same direction, and the second group of LED chips 22 includes 6 LED chips whose positive and negative electrodes are in the opposite direction to the first group. Chip, the electrode surfaces 213 of the two groups of LED chips are arranged face to face, the second group of LED chips 22 are set up between the adjacent two LED chips of the first group of LED chips 21, and their positive electrodes 221 are connected to the first group of LED chips. The negative electrode 212 of the LED assembly is connected to the p...

Embodiment 2

[0026] Such as Figure 5 to Figure 6 Shown is the chip electrode connection structure of the LED component described in the second embodiment of the present invention, a chip electrode connection structure of the LED component, including a plurality of LED chips and LED component power electrodes 32, the multiple The LED chips are divided into two groups. The first group of LED chips 31 includes 5 LED chips whose positive and negative electrodes are arranged at intervals in the same direction, and the second group of LED chips 32 includes 6 LEDs whose positive and negative electrodes are in the opposite direction to the first group. Chip, the electrode surfaces 313 of the two groups of LED chips are arranged face to face, the second group of LED chips 32 are set up between the adjacent two LED chips of the first group of LED chips 31, and the positive electrodes 321 of the first group of LED chips are connected to the first group of LED chips. The negative electrode 312 of the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the field of LED technology, and in particular relates to a chip electrode connection structure of an LED component, which includes a plurality of LED chips and LED component power electrodes. The plurality of LED chips are divided into two groups, and the first group of LED chips includes at least two positive electrodes. The negative electrodes are arranged at intervals in the same order. The second group of LED chips includes at least one LED chip whose positive and negative electrodes are opposite to the first group of LED chips. The electrodes of the two groups of LED chips are arranged face to face. The second group of LED chips The chips are set up between two adjacent LED chips of the first group of LED chips, and their positive electrodes are connected to the negative electrodes of the first group of LED chips, and their negative electrodes are connected to the positive electrodes of the first group of LED chips. The LED component leads out the LED component power electrode. In the electrode connection structure of the LED component of the present invention, the electrodes of the LED chips are not connected by wires or substrate circuits, and those that do not require LED flip-chip technology are connected by circuits on the substrate.

Description

technical field [0001] The invention belongs to the technical field of LEDs, and in particular relates to a chip electrode connection structure of an LED component. Background technique [0002] LED chips are only light-emitting devices, not lighting sources. LED lighting sources are generally made of multiple LED chips into LED components. The structure or process of electrode connection of LED chips in the prior art is as follows: [0003] 1. Single LED lamp bead: set the LED chip bracket, set the electrodes on the bracket, and connect the LED chip electrode and the bracket electrode with the wire through the binding process. [0004] 2. LED COB component: Set up the LED chip substrate, set up the circuit on the substrate, use wires to connect the LED chip electrodes and the substrate circuit through binding, and connect the LED chips to each other through the substrate circuit transition. [0005] 3. LED flip-chip process components: solve the problem of binding-free con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/62
CPCH01L2224/48091H01L2224/48137H01L2924/00014
Inventor 赖勇清
Owner FUJIAN YDJ LIGHT