Light emitter package and device with improved wire bonding and related methods

A light emitter, wire bonding technology, applied in semiconductor devices, electric solid state devices, electrical components, etc., can solve problems such as high thermal impedance, impact on LED chip performance, brightness and forward voltage.
CN103782403BActive Publication Date: 2017-06-30CREELED INC (N D GES D STAATES DELAWARE NEWARK)
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CREELED INC (N D GES D STAATES DELAWARE NEWARK)
Publication Date
2017-06-30

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Abstract

Light emitter packages and devices with improved wire bonding and related methods are disclosed. In one embodiment, the light emitter package may include at least one light emitting diode (LED) chip electrically connected to an electrical component by wire bonds. The wire bond can be passed through improved wire bonding parameters, such as a temperature of about 150° C. or less, a bonding time of about 100 ms or less, a power of about 1700 mW or less, and a force of about 100 grams force (gf) or less. force or a combination thereof.
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Description

[0001] Cross References to Related Applications

[0002] This application claims priority to US Provisional Patent Application 61 / 531,483, filed September 6, 2011, the entire contents of which are hereby incorporated by reference. technical field

[0003] The invention disclosed herein relates generally to wire bonding of light emitter devices, such as light emitting diode (LED) chips. More specifically, the invention disclosed herein relates to providing improved wire bonded light emitter devices and methods for improved thermal impedance. Background technique

[0004] Light-emitting devices such as light-emitting diodes (LEDs or LED chips) are currently used in many different general lighting applications and systems, for example, in lamps intended to replace incandescent, fluorescent and metal halide high-intensity discharge (HID) products. product. Thermal management and heat dissipation within LED packages is an area of ​​concern for LED chip and / or LED package manufa...

Claims

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