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Processing device

A technology for processing devices and objects to be processed, which is applied to fine work devices, stone processing equipment, work accessories, etc., and can solve problems such as difficulty in loading and unloading and maintaining workbench

Active Publication Date: 2017-08-11
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When processing wafers, the most suitable holding table is replaced according to the type of wafer. However, as mentioned above, when the weight of the holding table exceeds 20 kg, there is a problem that it is difficult for one person to attach and detach the holding table.

Method used

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Embodiment Construction

[0042] Hereinafter, preferred embodiments of the processing apparatus according to the present invention will be described in detail with reference to the drawings.

[0043] figure 1 A perspective view showing a cutting device as a processing device according to the present invention.

[0044] figure 1 The cutting device shown is equipped with the following parts: a stationary base 2; a workpiece holding mechanism 3, which is arranged on the stationary base 2 so as to be movable in the direction indicated by the arrow X in the machining feed direction, and holds The object to be processed is a wafer; the spindle supporting mechanism 6 is arranged on the stationary base so that it can move in the direction indicated by the arrow Y (the direction perpendicular to the direction indicated by the arrow X that is the machining feed direction) in the index feed direction. A base 2 ; and a spindle unit 7 as a cutting member (processing member) disposed on the spindle support mechani...

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Abstract

The invention provides a machining apparatus having a retaining component. The above retaining component has a light retaining workbench that is easy to dismount. The provided machining apparatus comprises the retaining component for holding a to-be-machined object; a machining component for machining the to-be-machined object held on the retaining component; and a machining feeding component for relatively machining and feeding the retaining component and the machining component in the machining and feeding direction. The retaining component is composed of a retaining workbench and a supporting pedestal. The retaining workbench has an attraction region for attracting and holding the to-be-machined object, and a periphery region surrounding the attraction region. The supporting pedestal supports the retaining workbench and enables the retaining workbench to be detachable, and attraction is transmitted to the above attraction region. The retaining workbench is formed by multi-porous ceramics, and a coating layer is applied to the region, except the attraction region, of the retaining workbench.

Description

technical field [0001] The present invention relates to processing devices such as cutting devices, laser processing devices, and grinding devices for processing workpieces such as wafers. Background technique [0002] In the manufacturing process of semiconductor devices, a plurality of regions are divided on the front surface of a substantially disk-shaped semiconductor wafer by dividing lines called streets arranged in a grid pattern, and ICs (integrated circuits) are formed in the divided regions. , LSI (Large Scale Integration) and other devices. In addition, the semiconductor wafer is cut along the lanes by a processing device such as a cutting device or a laser processing device to manufacture individual semiconductor devices. In addition, in order to reduce the size and weight of semiconductor devices, the back surface of the semiconductor wafer is ground to a predetermined thickness by a grinding device before the semiconductor wafer is cut along the lanes and divi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/02B28D7/04
CPCH01L21/67092
Inventor 马路良吾
Owner DISCO CORP
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