Identification structure in exposure process of high-density interconnection circuit board

Abstract

The invention relates to an identification structure in an exposure structure of a high-density interconnection circuit board. The identification structure includes a film. A graphic area is arranged on the film. At least one through hole is manufactured in the film at the outer side of the graphic area. A film piece which cooperates with the through hole is embedded in each through hole. Each film piece is connected with the film through a scotch tape. Identification symbols are arranged on the film pieces. In the identification structure in the exposure process of the high-density interconnection circuit board, at least one through hole is manufactured in the film at the outer side of the graphic area and a film piece with an identification symbol is embedded in each through hole; when exposure is performed, the identification symbols on the film pieces are also transferred on a product board; and after an acid etching process, the product board is provided with the identification symbols which can show operators and manufacturing devices and thus during post processing, once problems occur, past manufacturing conditions can be traced well and significantly conveniently.

Description

technical field [0001] The invention belongs to the technical field of high-density interconnect circuit board exposure technology, in particular to an identification structure in the high-density interconnect circuit board exposure process. Background technique [0002] The circuit board uses insulating material as the base layer, and the copper foil wire layer and various electronic components are laid on the base layer. The circuit board has been widely used in all aspects of people's daily work and life. During the processing of the circuit board, the graphics on the film need to be transferred. The specific operation process is: first, the exposure of the film 3 is carried out, so that the graphics in the graphics area 4 on the film are transferred to the product board, and then the product board is acid-etched. The transfer of the graphics is done after processing. [0003] After the above operation process is completed, the product board enters the next process for p...

AI Technical Summary

Problems solved by technology

[0003] After the above operation process is completed, the product board enters the next process for processing. However, in the existing process, it is impossible to find out which operator or which exposure machine completed the film exposure. This is mainly because there is no one on the product board. Effective identification, that is to say, once a problem occurs, the product board cannot be effectively traced

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