Hydrodynamic semi-contact fixed abrasive polishing device

Abstract

The invention discloses a fluid dynamic pressure half-contact solidification material grinding and polishing device which comprises a polishing disc composed of a polishing head and a polishing pad bonded on the polishing head, a workpiece clamping working table and a cooling liquid supply system, the polishing disc is of an annular structure with a hole in the middle, and cooling liquid is injected in a gap between the polishing pad and a workpiece from the central hole of the polishing disc and then is naturally discharged out around the polishing pad. According to the fluid dynamic pressure half-contact solidification material grinding and polishing device, the dynamic pressure and the film thickness of a clearance liquid film can be controlled by changing machining parameters under the condition of not replacing the polishing pad, therefore, the cutting depth of a fixed grain is controlled, and the complete set of machining process from rough polishing to fine polishing of the workpiece to be machined is achieved. The fluid dynamic pressure half-contact solidification material grinding and polishing device has the advantages of being simple in process, low in machining cost, and high in efficiency, and can meet use requirements of mass precision machining of the practical engineering.

Description

Technical field [0001] The invention relates to a surface forming polishing device used in precision processing, in particular to a solidified abrasive polishing device in a semi-contact state. Background technique [0002] Traditional fixed abrasive polishing is to disperse abrasive grains of a specific particle size into a polymer matrix, and prepare a polishing pad mainly composed of an abrasive grain layer, a rigid layer and an elastic layer through a solidification molding process, and then use the polishing pad The mat performs surface processing on the workpiece. In the polishing pad, the abrasive grain layer is a mixture of polymer and abrasive grains, the rigid layer is made of a harder material such as PC (polycarbonate), and the elastic layer is a soft polishing pad. The polishing pad made in this way has a certain hardness and is not easy to deform. With the uniform support of the elastic layer, the existing stress can be smoothly eliminated, hard scratches and other...

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problems in the prior art, the present invention provides a hydrodynamic pressure semi-contact fixed abrasive polishing device, which solves the need to successively adopt multiple groups of different abrasive grain sizes from coarse to fine in order to solve the traditional fixed abrasive processing in the prior art The polishing pad is processed, the process is cumbersome, the processing cost is high, the efficiency is low, and the positioning reference changes caused by multiple clamping workpieces or tools, etc.

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