Automatic maintenance equipment of probe card and method thereof

Abstract

The invention provides automatic maintenance equipment of a probe card and a method thereof. The automatic maintenance equipment of the probe card comprises a vacuum nozzle, a thimble and a probe. The thimble and the probe are both positioned inside the vacuum nozzle. The thimble can move along the side wall of the vacuum nozzle so as to adjust the position of the probe. The vacuum nozzle is shaped as a trumpet. The surface of the thimble is wavy. The equipment provided by the invention also comprises a mechanical arm. The vacuum nozzle is connected to the mechanical arm. The mechanical arm can control motion of the vacuum nozzle as well as movement of the thimble. In comparison with the prior art, the automatic maintenance equipment of the probe card and the method thereof have the following advantages: maintenance efficiency can be raised; maintenance precision is promoted; manual maintenance difference is avoided; manual fatigue operation problem is solved effectively; learning cycle is shortened for an engineer; maintenance time is shortened; and capacity requirement is raised greatly.

Description

technical field [0001] The invention relates to the field of chip package testing, in particular to the field of cantilever probe testing. Background technique [0002] The probe card is a test interface, which mainly tests the bare core, touches the signal contact of the chip to be tested with a fine probe, accesses the signal of the chip to be tested, and receives the feedback signal of the chip to be tested to determine whether the chip to be tested is able to function properly. [0003] The main structure of the probe card includes a circuit board, connecting elements, and a probe head. The probe head has probes, and the probes are arranged on a base. [0004] Most of the current semiconductor packaging tests use cantilever probe cards for electrical testing. With the increasing demand for production capacity, it is imperative to improve test stability and shorten test time. However, the chip test time is not enough How to improve test stability under changing conditio...

AI Technical Summary

Problems solved by technology

[0007] There are many disadvantages in this maintenance method, such as: repeated adjustments and confirmations are time-consuming and labor-intensive; and completely relying on personal feelings and techniques, different people have different results after calibration and maintenance, and the consistency of maintenance accuracy cannot be guaranteed; It takes more than 6 months to be able to work independently, and talent is easy to lose; long-term operation in the microscope working environment can easily cause eye fatigue, which relatively affects work efficiency

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