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Light emitting diode module and manufacturing method thereof

A technology of light-emitting diodes and modules, which is applied to semiconductor devices, light sources, electric light sources, etc. of light-emitting elements, can solve problems such as unfavorable backlight lighting, cannot completely eliminate central bright spots and edge yellow halo, and achieve the effect of preventing edge yellow halo.

Inactive Publication Date: 2014-07-02
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in actual use, after the light emitted by the light emitting diode is diffused by the lens, because the light is relatively concentrated near the optical axis of the light emitting diode, sometimes the phenomenon of central bright spots and edge yellow halos cannot be completely eliminated, which is not conducive to backlighting.

Method used

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  • Light emitting diode module and manufacturing method thereof

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Embodiment Construction

[0016] see figure 1 In one embodiment of the present invention, the LED module 10 includes a LED 20 , a lens 30 covering the LED 20 , and a diffusion film 40 covering the lens 30 .

[0017] The light emitting diode 20 includes a base 22 and a light emitting chip 24 fixed on the base 22 . The base 22 is made of insulating materials such as epoxy resin, silica gel or ceramics. The light-emitting chip 24 is made of semiconductor materials such as gallium nitride, indium gallium nitride, aluminum indium gallium nitride, etc., which can be excited by current to generate visible light.

[0018] The above-mentioned lens 30 is located right above the LED 20 and spaced apart from the LED 20 . The lens 30 is made of transparent materials such as polycarbonate or polymethyl methacrylate. The lens 30 includes a light incident surface 32 formed on its bottom surface, a light exit surface 34 opposite to the light incident surface 32 formed on its top surface, and a connecting surface 36 ...

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Abstract

A light emitting diode module comprises a light emitting diode and a lens covering the light emitting diode. The lens comprises a light incoming surface and a light emitting surface opposite to the light incoming surface. The light emitting diode module further comprises a diffusion film covering the light emitting surface of the lens. The diffusion film is made of a polyester compound doped with polymer diffusion particles. Compared with the prior art, the light emitting surface of the lens of the light emitting diode module is further covered with the diffusion film, and after light rays emitted by the light emitting diode are adjusted through the lens, the light rays are uniformly emitted through the diffusion film. Accordingly, the phenomena that a bright point occurs in the center of light emitted from the light emitting diode module and the edge of the light is dim are prevented. The invention further provides a manufacturing method of the light emitting diode module.

Description

technical field [0001] The invention relates to a light emitting diode module, in particular to a light emitting diode module used in a backlight module and a manufacturing method thereof. Background technique [0002] As an emerging light source, light emitting diodes have been widely used in various applications, especially backlighting. In backlighting, in order to uniform the light, it is usually used with a diffuser lens, so that the light emitted by the LED can be emitted at a larger angle, so as to achieve the effect of large-area lighting. [0003] However, in actual use, after the light emitted by the light emitting diode is diffused by the lens, because the light is relatively concentrated near the optical axis of the light emitting diode, sometimes the phenomenon of central bright spots and edge yellow halos cannot be completely eliminated, which is not conducive to backlighting. Contents of the invention [0004] Therefore, it is necessary to provide a light e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V5/04F21V17/10F21Y101/02F21K9/20F21K99/00F21Y115/10
Inventor 黄雍伦
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD