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Assembly for semi-conductor

A semiconductor and component technology, applied in the direction of printed circuits, instruments, identification devices, etc. connected with non-printed electrical components, can solve the problems of no heat dissipation structure on the circuit board, insufficient space for conductive copper wires, and insufficient space for integrated blocks, etc. The effect of reducing the cost of LED packaging, improving the clarity and reducing the cost

Inactive Publication Date: 2014-07-23
邹志峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing LED display has the problem that the circuit board has no heat dissipation structure and poor heat dissipation, and the LED of the existing LED display needs to be directly inserted into the LED bracket or the patch LED bracket. For LEDs with small LED light-emitting point spacing and high LED pixels Display screen, the PCB circuit board of the existing LED display screen has insufficient space for placing integrated blocks and insufficient space for setting via holes and conductive copper wires. In order to solve the above-mentioned problems, the present invention proposes a semiconductor component. The present invention adopts The technical solution is:

Method used

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  • Assembly for semi-conductor

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Embodiment Construction

[0018] This embodiment is a preferred implementation mode of the present invention, and all others whose principle and basic structure are the same or similar to this embodiment are within the protection scope of the present invention.

[0019] refer to figure 1 and figure 2 As shown in , a semiconductor component includes a light-emitting component; the light-emitting component includes an LED component and a line component 4 arranged horizontally; the line component 4 includes a rigid main substrate 3, a flexible upper flexible The substrate 2 and the upper wiring layer 1; the lower surface of the upper flexible substrate 2 is adhesively connected to the upper surface of the main substrate 3, and the upper surface of the upper flexible substrate 2 is adhesively connected to the lower surface of the upper wiring layer 1; the upper The upper surface of the wiring layer 1 is fixedly connected to the LED component; the LED component includes a plurality of LED monomers arrange...

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Abstract

An assembly for a semi-conductor relates to the technical field of LED packaging and LED display screens and solves the problems that a traditional LED display screen is poor in heat dispersion and long in distance between lighting points and needs an LED support. The assembly comprises an LED component and a circuit assembly, the circuit assembly comprises a main substrate, an upper flexible substrate and an upper wiring layer. The assembly further comprises a lower wiring layer and a lower flexible substrate, wherein the lower wiring layer is formed by extending the left end of the upper wiring layer downwards, the lower flexible substrate is formed by extending the left end of the upper flexible substrate downwards, the upper surface of the upper wiring layer is provided with a chip arranging position for arranging an LED chip, the lower portion of the wiring assembly is connected with a radiator, and an integrated block is arranged on the lower wiring layer. The LED support can not be used in production of the display screen, cost of LEDs and the LED display screens is greatly reduced, the distance between the lighting points of the display screen is short, heat dissipation is good, and performance is stable.

Description

technical field [0001] The invention relates to the technical field of LED packages and LED display screens. The LED display screens include the LED screens of LED TV sets, and the LED package belongs to the semiconductor technology. Background technique [0002] LED is a light-emitting diode packaged with LED chips. The LED display screen is a display screen formed by installing multiple LEDs on a circuit board and directly emitting light from the LEDs (there are other electronic components that control LEDs on the circuit board), especially red Green and blue three-in-one full-color display (one LED is a light-emitting point, one LED is a pixel, and three LED chips, 1 red, 1 green, and 1 blue, are placed in an LED bowl and packaged to form an LED); Display screens include outdoor LED display screens, indoor LED display screens, and LED TV display screens. LED display screens can also be called LED display screens. Existing LED display adopts PCB circuit board, and a plura...

Claims

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Application Information

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IPC IPC(8): G09F9/33H05K1/18
Inventor 邹志峰
Owner 邹志峰
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