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Single-ended power supply all-around LED lamp filament and manufacturing method thereof

A LED filament, single-ended power supply technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of insufficient reflection, fragile LED chip connection, inconvenient electrode connection, etc., to avoid insufficient reflection, coating process Improved, good luminous effect

Inactive Publication Date: 2014-07-30
BONSHINE OPTICAL ELECTRON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the technical defects of insufficient reflection, inconvenient electrode connection, and fragile LED chip connection of existing lamps that use LED chips to emit light, the invention discloses a single-end power supply omnidirectional LED filament and a preparation method thereof

Method used

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  • Single-ended power supply all-around LED lamp filament and manufacturing method thereof
  • Single-ended power supply all-around LED lamp filament and manufacturing method thereof

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Embodiment Construction

[0028] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0029] Such as figure 1 As shown, the present invention selects a strip substrate as the main body of the filament carrying the LED chip. The strip substrate is usually rectangular, and can also be chamfered at the corners of the rectangle. The length and width of the rectangle are similar to the usual filament size, for example, 10 mm wide , 150 mm long, the strip substrate must choose transparent insulating materials to ensure 360-degree omnidirectional light, in order to ensure the light transmission effect, the strip substrate should choose materials with high light transmittance, such as high borosilicate glass, high borosilicate glass ( Also known as hard glass), the linear thermal expansion coefficient is (3.3±0.1)×10-6 / K, and the light transmittance is even higher than that of ultra-white glass, which can reach more than 90%...

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Abstract

Provided is a single-ended power supply all-around LED lamp filament. Two rows of LED wafers are arranged on a strip-shaped substrate, each row of LED wafers are identical in front-back sequence, different rows of LED wafers are opposite in front-back sequence, and heads and tails of the LED wafers are connected through lead wires to form a U-shaped LED cluster. A pair of electrodes is arranged at one end of the strip-shaped substrate close to the U-shaped LED cluster, and each end LED is respectively connected with one electrode through an elargol conductive region formed by an elargol layer. All exposed surfaces of LED wafer regions arranged on the strip-shaped substrate are coated with fluorescent glue. The invention further discloses a method for manufacturing the single-ended power supply all-around LED lamp filament. Compared with the prior art, good light-emitting effect and good mechanical connecting firmness are obtained.

Description

technical field [0001] The invention relates to an LED preparation method, in particular to a single-end power supply omnidirectional LED filament and a preparation method thereof. Background technique [0002] With the popularity of LED lighting sources, the market has higher and higher requirements for the efficiency of LED lighting sources. According to the light-forming characteristics of the LED, the invention changes the utilization mode of the blue light emitted by the LED chip in the traditional process, and maximizes the utilization rate of the blue light to achieve higher light efficiency output. [0003] Light-emitting diodes are composed of a PN junction like ordinary diodes, and have unidirectional conductivity. When a forward voltage is applied to the light-emitting diode, the holes injected from the P region to the N region and the electrons injected from the N region to the P region are respectively connected to the electrons in the N region and the vacancie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/54H01L33/62
Inventor 谢益尚陈可王建全梁丽
Owner BONSHINE OPTICAL ELECTRON TECH
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