The invention discloses a
coupling packaging method based on a
laser direct-writing three-dimensional optical
chip, and the method achieves the
coupling packaging of a first device and a second device through the
laser direct-writing three-dimensional optical
chip, the first device is a planar
waveguide, and the second device is an
optical fiber system. Or both the first device and the second device are
optical fiber systems, and the method comprises the following steps: selecting a sample, determining mode field shapes, sizes and
refractive index distribution of to-be-butted end surfaces of the first device and the second device, and testing a damage threshold value of the sample; determining the size, structure and track arrangement of a
waveguide in the three-dimensional optical
chip according to the mode field shape, size and
refractive index distribution of the to-be-butted end surfaces of the first device and the second device; the sample is cleaned, the cleaned sample is fixed and leveled, and a
laser direct writing light path is calibrated; the
femtosecond laser directly writes the three-dimensional optical chip; the three-dimensional optical chip is polished; and carrying out
coupling packaging on the three-dimensional optical chip, the first device and the second device.