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Heat radiation assembly

A heat dissipation component and heat dissipation module technology, which is applied to digital data processing components, instruments, electrical digital data processing, etc., can solve the problems of difficult maintenance and high unit cost, and achieve good fixation effect

Active Publication Date: 2014-08-06
WISTRON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the common combination method between the air guide structure and the heat dissipation module is mostly in the form of double-sided adhesive adhesion, but this method has the disadvantages of high unit cost, difficult maintenance, and one-time use.

Method used

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Embodiment Construction

[0035] Please see first Figure 1A and Figure 1B As shown, the heat dissipation assembly 10 according to an embodiment of the present invention mainly includes a heat dissipation module 100 and an air guiding structure 200 . Wherein, the cooling module 100 has a plurality of fins 100a, and a plurality of grooves 100b are formed between adjacent fins 100a; Figure 1B Indicated by the arrow in), it mainly includes a cover body 202, wherein the cover body 202 is composed of a top cover 202a and two side panels 202b approximately perpendicular to the top cover 202a, and forms a "door" shaped cross section. In addition, the aforementioned two side plates 202b are substantially parallel to the fins 100a on the heat dissipation module 100, and a protruding portion 204 extends respectively on the same side of the two side plates 202b, wherein the protruding portion 204 can be in contact with the side plate 202b. Make bends at joints (such as Figure 1A in the direction of the arrow ...

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Abstract

A heat radiation assembly comprises a heat radiation module and an air deflection structure. The heat radiation module has multiple fins, wherein at least one groove is formed among the multiple fins. The air deflection structure is combined with the heat radiation module and has at least one projection which is mutually clamped with the groove. The effect of the heat radiation assembly is that the assembly of the heat radiation assembly is completed through the mutual clamping between the projection on the air delfection structure and the groove among the fins on the heat radiation module. Good fixity exists between the air deflection structure and the heat radiation module. The air deflection structure is made of a single material. Therefore, the heat radiation assembly is characterized by low cost, high reliability, etc.

Description

technical field [0001] The invention relates to a heat dissipation component; in particular, to a heat dissipation component with an air guiding structure. Background technique [0002] With the rapid development of science and technology, the processing speed and capability of computer systems have been significantly improved. However, there are problems including the heat generation and heat density of electronic components in the system. Traditionally, the heat dissipation of computer systems mostly uses fans to guide the airflow through the heat dissipation module through forced convection and air guide structure, so as to further achieve the effect of heat removal. [0003] At present, the common combination method between the air guide structure and the heat dissipation module is mostly in the form of double-sided adhesive, but this method has the disadvantages of high unit cost, difficult maintenance, and one-time use. Contents of the invention [0004] In view of ...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 林伯翰
Owner WISTRON CORP