Composite oxide sintered body, sputtering target, oxide transparent conductive film and manufacturing method thereof
A composite oxide and transparent conductive film technology, which is applied in the direction of oxide conductors, sputtering plating, circuits, etc., to achieve low light absorption characteristics and the effect of suppressing abnormal discharge
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Embodiment 1～10、 comparative example 1～8
[0079]
[0080] As raw material powders, indium oxide powder with a purity of 99.99% by weight and an average particle size of 0.5 μm, zirconia powder with a purity of 99.9% by weight and an average particle size of 0.2 μm, and yttrium oxide powder with a purity of 99.9% by weight and an average particle size of 0.2 μm were prepared. These raw material powders were weighed so that the atomic ratios described in Table 2 were obtained, and mixed by a dry ball mill to obtain mixed powders for molding. The average particle diameter of the mixed powder was 0.2 μm.
[0081] This mixed powder was molded according to the following procedure to produce a molded body. First, using a metal mold with a diameter of 150mm, at 0.3ton / cm 2 Pressurize to form the mixed powder. Next, carry out at 3.0ton / cm 2 Pressurized CIP molding yields a cylindrical molded body. This molded body was placed in a sintering furnace adjusted to a pure oxygen atmosphere, and fired under the following condit...
Embodiment 11～15
[0121]
[0122]Except for changing the firing conditions as shown in Table 1, it carried out similarly to Example 2, and produced the composite oxide sintered body. In this way, the composite oxide sintered bodies of Examples 11 to 15 were obtained. Other firing conditions not shown in Table 1 were the same as in Example 2.
[0123] [Table 1]
[0124]
Calcination temperature (℃)
Hold time (hours)
Example 11
1600
15
Example 12
1600
25
Example 13
1625
5
Example 14
1550
25
Example 15
1500
25
[0125]
[0126] Using the obtained composite oxide sintered body of each Example, it carried out similarly to Example 1, the sputtering target was produced, and the oxide transparent conductive film was obtained. And, it carried out similarly to Example 1, and evaluated the composite oxide sintered body and the oxide transparent conductive film. The evaluation results are shown in Table 2.
reference example 1
[0128]
[0129] As raw material powders, indium oxide powder with a purity of 99.99% by weight and an average particle diameter of 0.5 μm and tin oxide powder with a purity of 99.99% by weight and an average particle diameter of 0.5 μm were prepared. Indium oxide powder and tin oxide powder were weighed to make the weight ratio 97:3, and mixed by dry ball mill to prepare mixed powder for molding. The average particle diameter of the mixed powder was 0.2 μm.
[0130] Using the obtained mixed powder for molding, it carried out similarly to Example 1, and obtained the composite oxide sintered body, the sputtering target, and the oxide transparent conductive film. These evaluations were performed in the same manner as in Example 1. The evaluation results are shown in Table 2.
[0131] [Table 2]
[0132]
[0133] When comparing Examples 1 to 15 with Comparative Examples 1 to 8, it was confirmed that in Examples 1 to 15, an oxide transparent conductive film having a light ab...
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