Stripping device and stripping method of multilayer flexible film

A flexible film, peeling device technology, applied in chemical instruments and methods, lamination, layered products, etc., can solve the problems of lack of peeling ends, reduced peeling efficiency, poor peeling effect, etc.

Active Publication Date: 2014-08-20
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

There are obvious defects and deficiencies in the existing multi-layer film peeling device: the first is that the angle of the wedge-shaped peeling end of the peeling knife is a fixed value, usually 30 degrees or lower, and cannot adapt to different film materials, different interlayer adhesive forces, and different loads. The change of the stripping parameters such as the feed speed, so that the peeling knife with different angles need to be replaced when peeling different films, the stripping efficiency is reduced, and the scope of application of the stripping knife is too narrow; the second is due to the lack

Method used

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  • Stripping device and stripping method of multilayer flexible film
  • Stripping device and stripping method of multilayer flexible film
  • Stripping device and stripping method of multilayer flexible film

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Embodiment Construction

[0052] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0053] The inventors of the present application have found that whether the label is peeled off depends on the interfacial energy between the label and the carrier tape. and the bending potential energy G of the label Inlay Relationship. The interface energy forms the bonding force between the label and the carrier tape, and makes the label bend along with the carrier tape, that is, the greater the interface energy, the less likely the label will be peeled off; the bending potential energy refers to the rigidity of the label itself to keep the label straight, The effect of not following the bend...

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Abstract

The invention provides a stripping device of a multilayer flexible film. A stripping knife of the stripping device is of a columnar structure with a circular bead polygonal cross section, and is provided with a plurality of arc stripping surfaces with different bending radiuses and bending angles; during use, different stripping surfaces can be selected according to different films for stripping and processing without replacing the stripping knife, and thus the application range of the stripping knife is greatly enlarged; a relationship theory of a geometrical parameter and a stripping effect of the stripping knife is further applied, and an optimal stripping knife structure is designed and optimized, and thus optimal stripping quality and stripping efficiency are achieved; the stripping device is simple in structure and low in cost, and has a wide application prospect in the field of packaging of a large-area flexible device.

Description

technical field [0001] The invention relates to a peeling device and a peeling method of a multilayer flexible film, in particular to a peeling device and a peeling method for peeling an electronic label from a carrier tape. Background technique [0002] Flexible electronics is a technology that deposits or transfers electronic devices onto flexible substrates to form circuits. As an emerging electronic technology, flexible electronics is widely used in information, energy, medical , national defense and other fields have broad application prospects, such as flexible electronic displays, organic light-emitting diodes, RFID, thin-film solar panels, etc. [0003] In the process of manufacturing and packaging flexible electronic devices, it is often necessary to separate multilayer thin film structures. However, the traditional flip-chip bonding process (flip-chip) cannot achieve the peeling and transfer of large-area flexible structures. For the production of RFID tags, accor...

Claims

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Application Information

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IPC IPC(8): B32B38/10
Inventor 黄永安汤朋朋刘慧敏刘尊旭陈建魁尹周平
Owner HUAZHONG UNIV OF SCI & TECH
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