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A self-positioning mounting method for ceramic tube caps for packaging shells

A packaging shell and self-positioning technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as difficulty in meeting the production needs of mass production, low product yield and consistency, and affecting appearance quality. Achieve the effects of improving the finished product rate and quality consistency of racking, improving production efficiency and finished product rate, and improving appearance quality

Active Publication Date: 2016-08-17
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The adoption of this process has the following problems: first, the traditional racking method needs to be adjusted one by one after the microscope is enlarged, which is time-consuming and laborious, and the production efficiency is low, and it is difficult to meet the production needs of mass production; second, the product yield and consistency are relatively low. Low, because manual correction is used, it is inevitable that there will be certain differences between individuals, and even cause the size to be out of tolerance; third, because the ceramic component is in direct contact with the mold at the bottom layer, it often causes contamination and affects the appearance quality

Method used

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  • A self-positioning mounting method for ceramic tube caps for packaging shells
  • A self-positioning mounting method for ceramic tube caps for packaging shells
  • A self-positioning mounting method for ceramic tube caps for packaging shells

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Embodiment Construction

[0025] The present invention will be further explained below in conjunction with the drawings.

[0026] Control figure 1 , figure 2 with image 3 , Ceramic cap A, its structure includes a metal soldering ring; ceramic components and silver-copper solder, wherein the silver-copper solder is placed between the ceramic component and the metal soldering ring, and the three are welded together at the brazing temperature.

[0027] (1) Mold design: including

[0028] 1) According to the length dimension X1=10.55mm of the ceramic parts and the matching dimension tolerance x'=0.02~0.1mm, design the length dimension X=10.57mm~10.65mm of the self-positioning embedded mounting mold of the ceramic cap;

[0029] 2) According to the width dimension Y1=9.07mm of the ceramic parts and the matching dimension tolerance y'=0.02~0.1mm, design the width dimension Y=9.09mm~9.17mm of the self-positioning embedded mounting mold of the ceramic cap;

[0030] 3) According to the height dimension of ceramic parts ...

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Abstract

The invention discloses a self-positioning racking method of a ceramic pipe cap for packaging an outer shell. According to the method, a corresponding embedded type racking graphite die is designed according to the sizes of ceramic components, pressing, plugging and manual setting right are not needed by adopting the racking method of placing a welding loop firstly and placing welding flux and ceramic components secondly, and self-positioning racking of the ceramic pipe cap is achieved. The method has the advantages that positioning design of positioning the length, width and depth of a notch in an embedded racking mode is adopted, self-positioning of the welding loop, the welding flux and the ceramic components is achieved, a plurality of procedures are simplified, racking of the ceramic pipe cap is finished, and consistence and production efficiency of the ceramic pipe cap are greatly improved. The ceramic pipe cap manufactured based on the technology process and method can meet the air impermeability packaging requirement of packaging of the outer shell, and is applied in a plurality of projects, and obvious benefits are obtained.

Description

Technical field [0001] The invention relates to a self-positioning mounting method of a ceramic tube cap for a packaging shell, belonging to the technical field of mounting of electronic packaging, in particular to the technical field of mounting of a ceramic tube cap. [0002] The design of the embedded mounting mold is adopted to realize the self-positioning mounting of the solder ring, solder and ceramic components, without the need for pressing plugs and correcting under the microscope, simplifying the process, improving product consistency and production efficiency. Background technique [0003] In the current electronic packaging field, a considerable part of the housing is airtightly sealed with ceramic caps. The traditional mounting mode of ceramic caps is to place ceramic components in a bottom-up order on a flat mold. The brazing material, the metal welding ring and the metal pressing plug are then adjusted one by one under the microscope, and then enter the brazing furna...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68
CPCH01L21/68
Inventor 陈宇宁许丽清程凯李华新夏雨楠刘思栋
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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