A self-positioning mounting method for ceramic tube caps for packaging shells
A packaging shell and self-positioning technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as difficulty in meeting the production needs of mass production, low product yield and consistency, and affecting appearance quality. Achieve the effects of improving the finished product rate and quality consistency of racking, improving production efficiency and finished product rate, and improving appearance quality
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[0025] The present invention will be further explained below in conjunction with the drawings.
[0026] Control figure 1 , figure 2 with image 3 , Ceramic cap A, its structure includes a metal soldering ring; ceramic components and silver-copper solder, wherein the silver-copper solder is placed between the ceramic component and the metal soldering ring, and the three are welded together at the brazing temperature.
[0027] (1) Mold design: including
[0028] 1) According to the length dimension X1=10.55mm of the ceramic parts and the matching dimension tolerance x'=0.02~0.1mm, design the length dimension X=10.57mm~10.65mm of the self-positioning embedded mounting mold of the ceramic cap;
[0029] 2) According to the width dimension Y1=9.07mm of the ceramic parts and the matching dimension tolerance y'=0.02~0.1mm, design the width dimension Y=9.09mm~9.17mm of the self-positioning embedded mounting mold of the ceramic cap;
[0030] 3) According to the height dimension of ceramic parts ...
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