Self-positioning mounting method for annular ceramic packaging shell
A technology of ceramic packaging and ring-shaped shells, which is applied in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of high difficulty in mounting ring-shaped shells, poor product consistency, time-consuming and labor-intensive problems, and improve production feasibility. and yield rate, improving the feasibility and yield rate of racking, and simplifying the effect of racking process
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[0020] The present invention will be further explained below in conjunction with the drawings.
[0021] Contrast figure 1 , Figure 2 and image 3 , A ring-shaped ceramic package housing, the structure of which includes an upper flange 1, a ceramic component 2, a lower flange 3. The upper flange 1, a ceramic component 2, and a lower flange 3 are connected from top to bottom by soldering.
[0022] As shown in the figure, the self-positioning mounting method of the ring-shaped ceramic package shell, the corresponding embedded mounting mold is designed, and the mold cooperation is used to realize the self-positioning between the upper and lower flanges and the ceramic components; through the embedded mounting mold The positioning design of the diameter and height of each position of the upper and lower components to realize the self-positioning of the lower flange, ceramic components, upper flange and solder includes the following steps:
[0023] (1) Mold design,
[0024] (2) Parts prepa...
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