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Self-positioning mounting method for annular ceramic packaging shell

A technology of ceramic packaging and ring-shaped shells, which is applied in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of high difficulty in mounting ring-shaped shells, poor product consistency, time-consuming and labor-intensive problems, and improve production feasibility. and yield rate, improving the feasibility and yield rate of racking, and simplifying the effect of racking process

Active Publication Date: 2020-10-02
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, the mounting difficulty of the ring-shaped shell itself is relatively high. Relying on the microscope to magnify and adjust one by one, it is time-consuming and laborious, the production efficiency is low, and the consistency of the product is relatively poor; Unable to confirm, there is a high probability of defective products after the shell production is completed
Therefore, it is quite difficult to use the traditional racking process for production

Method used

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  • Self-positioning mounting method for annular ceramic packaging shell
  • Self-positioning mounting method for annular ceramic packaging shell
  • Self-positioning mounting method for annular ceramic packaging shell

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Embodiment Construction

[0020] The present invention will be further explained below in conjunction with the drawings.

[0021] Contrast figure 1 , Figure 2 and image 3 , A ring-shaped ceramic package housing, the structure of which includes an upper flange 1, a ceramic component 2, a lower flange 3. The upper flange 1, a ceramic component 2, and a lower flange 3 are connected from top to bottom by soldering.

[0022] As shown in the figure, the self-positioning mounting method of the ring-shaped ceramic package shell, the corresponding embedded mounting mold is designed, and the mold cooperation is used to realize the self-positioning between the upper and lower flanges and the ceramic components; through the embedded mounting mold The positioning design of the diameter and height of each position of the upper and lower components to realize the self-positioning of the lower flange, ceramic components, upper flange and solder includes the following steps:

[0023] (1) Mold design,

[0024] (2) Parts prepa...

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Abstract

The present invention is a self-positioning mounting method for an annular ceramic packaging shell, wherein the structure of the annular ceramic packaging shell includes an upper flange, a ceramic assembly, and a lower flange, and the upper flange, ceramic assembly, and lower flange are connected through solder from top to bottom . Self-positioning mounting method: Design the corresponding embedded mounting mold, and use the mold to realize the self-positioning between the upper and lower flanges and the ceramic component; through the diameter and position of the upper and lower components of the embedded mounting mold High positioning design to realize the self-positioning of the lower flange, ceramic components, upper flange and solder, including the following steps: (1) mold design; (2) parts preparation; (3) mounting and brazing. Advantages: Ensure the positioning accuracy of components, avoid errors caused by manual adjustment, improve the consistency of finished shells; improve product yield, improve the racking efficiency of annular shells, and realize mass production of products.

Description

Technical field [0001] The invention relates to a self-positioning and mounting method for a ring-shaped ceramic packaging shell, belonging to the technical field of mounting and mounting of electronic packaging, and in particular to the technical field of mounting and mounting a ring-shaped ceramic shell. The design of the embedded mounting mold is adopted to realize the self-positioning mounting of flange parts, solder and ceramic components, and to ensure the concentricity of each component. Through self-positioning and mounting, the process of placing the plug and correcting under the microscope is eliminated, and the product consistency and production efficiency are improved. Background technique [0002] In the current electronic packaging field, a part of the housing has special characteristics, and they usually use a ring-shaped ceramic component with a ring-shaped flange to form the main body of the housing. In addition to the normal shell sealing requirements, the ring...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68H01L23/04
CPCH01L21/68H01L23/04
Inventor 刘海许丽清陈宇宁夏雨楠
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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