Integrated device for bonding, hot pressing and glue injection of LED substrate and lens
A LED substrate and glue injection technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of poor product quality stability, complex packaging process of high-power LEDs, and large labor force, so as to improve packaging quality and stability, The effect of reducing the number of equipment and reducing labor force
Inactive Publication Date: 2014-08-27
SOUTH CHINA UNIV OF TECH
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This results in complex post-packaging process of high-power LEDs, large labor force and poor stability of product quality.
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[0029] The purpose of the invention of the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments, and the embodiments cannot be repeated here one by one, but the implementation of the present invention is not therefore limited to the following embodiments.
[0030] Such as figure 1 As shown, an integrated equipment for LED substrate and lens bonding, hot pressing and glue injection, including: feeding device for inputting LED base and lens, bonding mechanism 03, hot pressing mechanism 04, glue injection mechanism 05, The discharging device, the substrate and the conveying mechanism 08 for outputting finished products, the feeding device and the discharging device are respectively arranged at both ends of the substrate and the conveying mechanism 08, the bonding mechanism 03, the hot pressing mechanism 04, the glue injection mechanism 05) Arranged sequentially on the substrate and the conveying mechani...
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The invention discloses an integrated device for bonding, hot pressing and glue injection of an LED substrate and a lens. The integrated device for bonding, hot pressing and glue injection of the LED substrate and the lens comprises a feeding device, a bonding mechanism, a hot pressing mechanism, a glue injection mechanism, a discharging device, a base plate and a transferring mechanism, wherein the feeding device is used for feeding the LED substrate and the lens, the discharging device is used for discharging a finished product, the feeding device and the discharging device are arranged at the two ends of the base plate and the transferring mechanism respectively, and the bonding mechanism, the hot pressing mechanism and the glue injection mechanism are arranged on the base plate and the transferring mechanism in sequence in the conveying direction of a conveying belt. According to the integrated device for bonding, hot pressing and glue injection of the LED substrate and the lens, through the integration of bonding, hot pressing and glue injection of the LED substrate and the lens, integration and unification of bonding, hot pressing and glue injection of groups of optical lens type high-power LED package substrates and lenses are achieved, the number of devices required during later-stage packaging of the groups of high-power LEDs is further reduced, automatic later-stage packaging of the groups of optical lens type high-power LEDs is achieved, in this way, labor is reduced, the packaging quality and the packaging stability of the high-power LEDs are improved.
Description
[0001] technical field [0002] The invention relates to the technical field of LED module packaging. . In particular, it relates to an integrated equipment for LED substrate and lens bonding, hot pressing and glue injection. Background technique [0003] The post-production process of group high-power LED packaging includes: phosphor coating, LED substrate and lens bonding, lens hot pressing, glue injection into the lens, furnace passing after glue injection, and spectroscopic and color separation detection. Each process relies on special equipment for operation: phosphor coating relies on phosphor coating machine, substrate and lens bonding relies on substrate and lens bonding machine, high-power LED spectroscopic and color separation detection relies on spectroscopic and color separation detection machine Wait. This results in complex post-packaging process of high-power LEDs, large labor force and poor stability of product quality. [0004] The invention discloses an...
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IPC IPC(8): H01L33/00H01L33/48
CPCH01L33/48H01L2933/0033
Inventor 陈安胡跃明刘伟东吴忻生
Owner SOUTH CHINA UNIV OF TECH