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Testing structure and testing method for transistor overlapping capacitance

A technology for testing structure and overlapping capacitance, which is applied in circuits, measuring devices, electrical components, etc., can solve the problems of complex testing methods for transistor overlapping capacitance and difficulty in accurately obtaining overlapping capacitance values.

Active Publication Date: 2014-09-03
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the prior art, the test method for the overlapping capacitance of the transistor is complicated, and it is difficult to accurately obtain the value of the overlapping capacitance

Method used

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  • Testing structure and testing method for transistor overlapping capacitance
  • Testing structure and testing method for transistor overlapping capacitance
  • Testing structure and testing method for transistor overlapping capacitance

Examples

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no. 1 example

[0038] Please refer to figure 2 , providing the first test structure.

[0039] The first test structure includes a first transistor 110 formed on the first semiconductor substrate 100, a first connection structure 120a, and a first connection structure 120b, and the first transistor includes a first transistor on the first semiconductor substrate 100. A gate structure, the first gate structure includes a first gate dielectric layer 101, a first gate 102 located on the surface of the first gate dielectric layer 101, a first gate gate 102 located on the first gate dielectric layer 101 and a first gate The first side wall 105 on the side wall surface of the pole 102 .

[0040] The first test structure further includes a first source region 103 and a first drain region 104 located in the first semiconductor substrate 100 on both sides of the first gate 102 . Parts of the first source region 103 and the first drain region 104 are located under the first gate structure, forming a...

no. 2 example

[0065] In other embodiments of the present invention, the first test structure and the second test structure may also have a plurality of transistors.

[0066] Please refer to Figure 6 , is a top view of the first test structure in the second embodiment. The first test structure includes a plurality of strip-shaped first transistors 310 arranged side by side on the first semiconductor substrate 300 and a first connection structure 320 parallel to the first gate structure 301 of the first transistors 310 , and the source and drain regions of adjacent first transistors between the first transistors 310 arranged in parallel are shared, so the first connection structure 320 is connected to the shared source and drain regions at the same time. And there is a first overlapping region of source and drain (not shown in the figure) under the first gate 301 .

[0067] Specifically, the number of first transistors 310 in the first test structure is n, where n is greater than or equal ...

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Abstract

A testing structure and a testing method for transistor overlapping capacitance are provided; the testing method for transistor overlapping capacitance comprises the following steps: providing a first testing structure comprising a first transistor and a first connecting structure formed on a first semiconductor substrate, a first overlapping zone positioned below a first grid electrode is arranged in a first source zone and a first leakage zone of the first transistor, and the first connecting structure is positioned on a surface of the first source zone and the first leakage zone; testing to obtain a first capacitance between the first grid electrode and the first connecting structure; providing a second testing structure comprising a second transistor and a second connecting structure formed on a second semiconductor substrate, no overlapping zone below a second grid electrode structure is arranged in a second source zone and a second leakage zone of the second transistor, and the second connecting structure is positioned on a surface of the second source zone and the second leakage zone; testing a second capacitance between the second grid electrode and the second connecting structure; calculating to obtain the overlapping capacitance of the first transistor.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a test structure and a test method for transistor overlap capacitance. Background technique [0002] In the field of existing integrated circuits and semiconductor manufacturing, transistors are one of the basic components constituting semiconductor devices, and are therefore widely used. With the integration of integrated circuits and the miniaturization of semiconductor devices, the performance of transistors has an increasingly significant impact on integrated circuits. Among the factors affecting the performance of transistors, the overlapping capacitance of transistors has an influence on the operating efficiency of semiconductor devices formed of transistors. [0003] Please refer to figure 1 , is a schematic cross-sectional structure diagram of a transistor in the prior art, including: a semiconductor substrate 10; a gate structure 11 located on the surface of the...

Claims

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Application Information

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IPC IPC(8): H01L23/544G01R27/26
Inventor 李勇洪中山
Owner SEMICON MFG INT (SHANGHAI) CORP