Unlock instant, AI-driven research and patent intelligence for your innovation.

A briquetting block and a crimping device for crimping a chip-on-chip film

A chip-on-film and crimping device technology, applied in nonlinear optics, instruments, optics, etc., can solve problems such as fragmentation and poor cutting of glass substrates, and achieve the effect of avoiding fragmentation

Active Publication Date: 2017-01-25
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, during the cutting process, protrusions (poor cutting) occur at the corners of the glass substrate
When the elongated block will press on the entire edge of the glass substrate, the elongated block interferes with the protrusion of the corner, which may cause chipping

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A briquetting block and a crimping device for crimping a chip-on-chip film
  • A briquetting block and a crimping device for crimping a chip-on-chip film
  • A briquetting block and a crimping device for crimping a chip-on-chip film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0025] As mentioned above, in the chip-on-chip bonding process of liquid crystal panel production, pre-pressing and main-pressing processes are required. Such as figure 1 As shown, in this pressing process, a pressing block 200 for pressing the chip-on-chip film is used for pressing. The compact 200 is an elongated compact. The entire side of the glass substrate 120 is pressed in the pressing direction P by a pressing block 200 for pressing the COF. Such as figure 2 As shown, during the cutting process, the corner C of the glass substrate 120 may form a protrusion due to cutting. At this time, if the pressing block 200 for crimping the chip-on-chip film is pressed against the protrusion, it may cause breakage.

[0026] Such as image 3 As shown, the pressing block 200 for crimping the COF film in this embodiment includes a body 201 , ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a pressure block for crimping a chip on film and a crimping device. The pressure block (200) for crimping the chip on film comprises a body (201), wherein a groove structure (209) is arranged at a position corresponding to the corner (C) of a glass substrate (120) on the body (201). In the pressure block, the groove structure is arranged at the position corresponding to the corner of the glass substrate on the body, thereby avoiding breakage caused by extruding interference between the pressure block and the corner.

Description

technical field [0001] The invention belongs to the field of liquid crystal display. Specifically, the present invention relates to a pressing block and a pressing device for pressing a chip-on-chip film. Background technique [0002] In the bonding process (bonding process) of the chip on film (COF: chip on film) produced by the LCD panel, pre-pressing and main pressing processes are required. In this pressing process, if a long bar is used for compaction, the bar will be pressed against the entire edge of the glass substrate. [0003] However, during the cutting process, protrusions (poor cutting) may occur at the corners of the glass substrate. When the elongated weights would press against the entire edge of the glass substrate, the elongated weights would interfere with protrusions in the corners, possibly causing chipping. Contents of the invention [0004] The object of the present invention is to provide a pressing block for crimping the chip-on-chip film, which...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13
Inventor 邓鸿韬
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD