Packaging box

Abstract

The invention provides a packaging box which comprises a base and a plurality of box bodies, wherein the box bodies can be piled on one another; accommodating cavities used for the loading of a liquidcrystal display are formed in the box bodies; each box body is provided with an opening, and the opening communicates with the corresponding accommodating cavity; a circle of a first bump is arrangedon the edge of each opening; a first groove is formed in the bottom of each box body; the section of the base is wedge-shaped, and then an inclined surface is formed on the surface of the upper end of the base; a second bump is arranged on the inclined surface; and when being sequentially piled on the base, the box bodies are all arranged in an inclined manner. Compared with the prior art, the packaging box has the advantages that through the arrangement of a layer of the wedge-shaped base at the bottom end of the piled box bodies, the box bodies are all arranged in an inclined manner after being piled on one another, so that the impact force between the side, positioned at a COF circuit board, of the liquid crystal display and the box bodies can be reduced during transportation, the problem that the liquid crystal display is broken can be avoided, and the reliability of box bodies can be improved.

Description

technical field [0001] The invention relates to a liquid crystal display packaging technology, in particular to a packaging box. Background technique [0002] With the development of the display industry, the size of LCD screens is getting larger and larger, and the transportation and packaging of large-size LCD screens has become a difficult point, especially the multi-COF circuit board (Chip On Flex, or, Chip On Film, often called flip chip film), in order to fix the liquid crystal display, the liquid crystal display accommodating cavity for loading the liquid crystal display in the packaging box is often made according to the external shape of the liquid crystal display, which will lead to packaging The distance between the right-angled side of the box on the side of the COF circuit board and the COF circuit board is quite close, resulting in damage to the right-angled side of the COF circuit board side of the LCD display when it is packaged and transported in an ordinary...

AI Technical Summary

Problems solved by technology

[0002] With the development of the display industry, the size of LCD screens is getting larger and larger, and the transportation and packaging of large-size LCD screens has become a difficult point, especially the multi-COF circuit board (Chip On Flex, or, Chip On Film, often called flip chip film), in order to fix the liquid crystal display, the liquid crystal display accommodating cavity for loading the liquid crystal display in the packaging box is often made according to the external shape of the liquid crystal display, which will lead to packaging The distance between the right-angled side of the box on the side of the COF circuit board and the COF circuit board is quite close, resulting in damage to the right-angled side of the COF circuit board side of the LCD display when it is packaged and transported in an ordinary flat stack, causing adverse effects

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