12results about How to "Avoid Fragments" patented technology

The application discloses a packaging material, which comprises a weather-resistant layer, a supporting layer, a conductive layer and a buffer layer. The supporting layer is connected to one side of the weather-resistant layer, and the conductive layer is connected to the side of the supporting layer away from the weather-resistant layer. The conductive layer is a patterned layer, and the conductive layer comprises a hollow part. The projection of the hollow part on the supporting layer is defined as a hollow projection. The buffer layer is a patterned layer, and the buffer layer is configured to be at least partially inlaid in the hollow part of the conductive layer. The buffer layer is configured to be at least partially protruded from the conductive layer. The projection of the buffer layer on the supporting layer is defined as a buffer projection. The hollow projection and the buffer projection substantially coincide. By using the packaging material to package a photovoltaic module, the structure of the photovoltaic module and the process complexity during packaging can be simplified.

The application provides a wafer automatic cleaning device and a wafer cutting machine. The wafer automatic cleaning device is used for cleaning a wafer and comprises a cleaning nozzle, a sensor, a deionization pump and a connecting pipe. The cleaning nozzle is arranged directly below a moving path of the wafer, and a side of the cleaning nozzle opposite to the moving path of the wafer is provided with a plurality of air blowing holes. The sensor is arranged on one side of the cleaning nozzle to detect position information of the wafer. The deionization pump is provided with a controller, and the controller is in communication connection with the sensor to control the deionization pump according to a state of the sensor. One end of the connecting pipe is communicated with the deionization pump, and the other end of the connecting pipe is communicated with the cleaning nozzle. The wafer automatic cleaning device realizes automatic cleaning of the wafer, does not cause damage to the wafer itself, reduces manual cleaning of a back surface of the wafer, avoids breakage and electrostatic breakdown problems caused by manual cleaning, avoids introduction of new particulate impurities in wafer transportation between front and rear process stations, and ensures cleanliness of the wafer during wafer operation.

This invention relates to the field of electroplating technology and discloses a substrate electroplating device, including an electroplating module, an electroplating solution storage tank, a power module, a power supply module, and a loading / unloading module. The electroplating module includes an electroplating chamber and an electroplating assembly. The electroplating chamber consists of a first cavity and a second cavity arranged correspondingly. The electroplating assembly includes a first anode and a second anode arranged correspondingly in the vertical direction. A first spray element and a second spray element, a first cathode and a second cathode are arranged correspondingly between the first anode and the second anode. A return pipe is provided between the electroplating solution storage tank and the first cavity, and an overflow pipe is provided between the electroplating solution storage tank and the second cavity. The power module transports the electrolyte from the electroplating solution storage tank to the electroplating chamber. It can be seen that the substrate electroplating device of this solution has a reasonable overall design and adopts a horizontal electroplating method, which can avoid the problem of substrate breakage during clamping and subsequent operation. At the same time, the double-sided electroplating method has a more uniform plating effect.

The utility model belongs to the technical field of silicon wafer cleaning, and particularly relates to an upper pressing wheel assembly and chained cleaning equipment, the upper pressing wheel assembly comprises an upper pressing rod, a plurality of pressing wheel bodies are sleeved on the upper pressing rod, and the pressing marks of the pressing wheel bodies on a silicon wafer are wide; an annular hold-down ring is arranged on the side wall of the pinch roller body, the side wall of the hold-down ring is a hold-down surface, and the edges of the top and the bottom of a projection pattern of the hold-down surface along the axis of the pinch roller body are straight lines, so that a wide indentation is formed after the hold-down surface is in contact with a silicon wafer; in short, the indentations of the pinch roller body and the silicon wafer are designed to be wide, so that the indentation product of the pressing surface and the silicon wafer is increased, the pressure intensity of the pinch roller body on the silicon wafer is reduced under the same pressure, and the pinch roller body is prevented from leaving the indentations on the silicon wafer and even causing the silicon wafer to be broken.

The embodiment of the invention relates to the field of photovoltaic technology, provides a back contact solar cell and a photovoltaic module, and solves the problem of module fragment caused by battery warping so as to improve the product yield. The back contact solar cell comprises a substrate which comprises a front surface and a back surface which are oppositely arranged, and a side surface connecting the front surface and the back surface; the first electrode unit and the second electrode unit are arranged on the back surface of the substrate and are insulated from each other; the first connecting unit and the second connecting unit are arranged on the back face of the substrate and are insulated from each other, the first connecting unit is electrically connected with the first electrode unit, and the second connecting unit is electrically connected with the second electrode unit; the third connecting unit and the fourth connecting unit are arranged on the front surface of the substrate and are insulated from each other; the first conductive unit and the second conductive unit are arranged on the side face of the substrate and are insulated from each other, the first conductive unit is electrically connected with the first connecting unit and the third connecting unit, and the second conductive unit is electrically connected with the second connecting unit and the fourth connecting unit.

The application discloses a kind of warping LED chip protection liquid method, in turn is chip front face film, back cutting, chip overturn, protection liquid drop, protective film covers, vacuum adsorption and centrifugal rotation.Combining the warping characteristics of the existing grinding method to the LED chip, by chip front face film, reduce the risk of chip fragment, chip back cutting releases grinding stress to reduce chip warping, protective film covers can guarantee that all areas of warping LED chip are wrapped with protection liquid, centrifugal rotation makes the protection liquid of LED chip surface everywhere uniform, forms tight and uniform protective layer on the surface of LED chip, plays the role of isolation heat and metal debris when laser cutting, achieves the effect that chip surface circuit is not oxidized and chip is not broken edge, after laser cutting, clean up metal debris and residual protective layer completely.

The embodiment of the invention provides wafer film pasting equipment and a wafer film pasting method, and the equipment comprises an equipment pedestal which is used for fixing a to-be-coated wafer and placing a steel ring with a DDAF film; the positioning device is arranged on the equipment base and is used for moving the position of the steel ring to a fixed position, so that the circle center of the steel ring is aligned with the circle center of the wafer to be coated with the film; the positioning device comprises a fixing structure and a positioning structure, wherein the fixing structure is fixed at the edge position of one side of the equipment base; the moving structure is arranged at the edge position of the other side, opposite to the fixed structure, of the equipment base, and in the direction pointing to the circle center of the wafer to be coated, the moving structure pushes the steel ring to the fixed structure so that the steel ring can be located at the fixed position; and the circle center of the fixed position is the same as the circle center of the film-coated wafer. Therefore, the concentricity of the wafer to be coated and the circle center of the steel ring can be improved, and the quality of the coating process is improved.

A detachable orthodontic auxiliary arch tube device comprises a main body, the main body is provided with an installation opening used for installing a fixed orthodontic appliance, the installation opening penetrates through the front face and the bottom face of the main body, the side wall of the main body is further connected with a carrying tube, and the carrying tube is connected with a detachable auxiliary arch tube. After the auxiliary arch wire is arranged in the auxiliary arch tube, the whole auxiliary arch tube device is positioned on a specific tooth position, so that the auxiliary arch wire only applies force to the tooth position, and compared with an existing mode of applying force to the whole main arch wire, the auxiliary arch tube device can avoid applying force to the dentition in a segmented or whole-section manner, so that the correction efficiency and the correction effect are effectively improved.

This invention discloses an ultra-thin flexible glass cleaning system, belonging to the field of ultra-thin flexible glass technology. The technical solution includes a glass conveying mechanism and a glass loading mechanism with its loading end. Glass from the glass roll is conveyed to the glass conveying mechanism via the glass loading mechanism. Above the glass conveying mechanism, from the loading end to the unloading end, are sequentially arranged a cleaning adhesive dispensing mechanism, an adhesive spreading mechanism, a cooling mechanism, and an adhesive peeling mechanism. These mechanisms sequentially drip cleaning adhesive onto the glass on the glass conveying mechanism, spread the cleaning adhesive evenly on the glass, cool the cleaning adhesive, and peel off the cleaning adhesive, ultimately removing dust and dirt from the glass. This invention utilizes the dust-adhesion and dirt-removing principle of the cleaning adhesive, avoiding the breakage and scratches caused by brushes during traditional flatbed cleaning, while enabling rapid and efficient cleaning of the ultra-thin flexible glass surface. Furthermore, it can continuously clean uncut rolls of ultra-thin flexible glass, improving efficiency.

The invention provides a wafer cleaning device, a cleaning method and wafer thinning equipment. The wafer cleaning device is used for wafer thinning equipment, a clamping wheel of a mechanical arm of the wafer thinning equipment keeps a wafer in place for wafer cleaning, the wafer cleaning device comprises a spraying rotating part used for spraying cleaning fluid to the back face of the wafer to be cleaned, a first flow channel is formed in the spraying rotating part, and a second flow channel is formed in the spraying rotating part; spraying holes are distributed in the side face, facing the back face of the wafer, of the spraying rotating piece, and the spraying holes are used for spraying cleaning fluid; the hollow rotating shaft is connected to the rotating center of the spraying rotating piece, a second flow channel is formed in the hollow rotating shaft, and the first flow channel communicates with the second flow channel; and the driving mechanism is used for driving the hollow rotating shaft to drive the spraying rotating part to rotate while the spraying rotating part sprays the cleaning fluid to the back surface of the wafer. According to the method, non-contact back cleaning is used in wafer thinning, so that the back of the wafer can be effectively prevented from being polluted, scratched and broken.

The utility model belongs to the technical field of photovoltaic assembly manufacturing, and particularly relates to a photovoltaic assembly convenient to disassemble, which comprises a steel tile, a plurality of flexible assemblies and a plurality of pressing blocks, the steel tile is detachably connected with the plurality of flexible assemblies through the plurality of pressing blocks, and the plurality of flexible assemblies are arranged at the top end of the steel tile; the pressing block comprises a transverse plate and a vertical plate, and the transverse plate is perpendicular to the vertical plate. A first connecting hole is formed in the middle of the transverse plate; an upper clamping plate is arranged at the end, away from the transverse plate, of the vertical plate, a lower clamping plate is arranged at the end, close to the transverse plate, of the vertical plate, and a notch is formed by the upper clamping plate and the lower clamping plate. A plurality of second connecting holes are formed in the top end of the steel tile and matched with the first connecting holes correspondingly. The two ends of the flexible assembly are placed in the multiple notches. And the plurality of pressing blocks are detachably connected with the steel tiles through the plurality of bolts. The photovoltaic module has the effects of being convenient to mount and dismount and further improving the use efficiency of the module.