5results about How to "Avoid fragments" patented technology

The application provides a wafer automatic cleaning device and a wafer cutting machine. The wafer automatic cleaning device is used for cleaning a wafer and comprises a cleaning nozzle, a sensor, a deionization pump and a connecting pipe. The cleaning nozzle is arranged directly below a moving path of the wafer, and a side of the cleaning nozzle opposite to the moving path of the wafer is provided with a plurality of air blowing holes. The sensor is arranged on one side of the cleaning nozzle to detect position information of the wafer. The deionization pump is provided with a controller, and the controller is in communication connection with the sensor to control the deionization pump according to a state of the sensor. One end of the connecting pipe is communicated with the deionization pump, and the other end of the connecting pipe is communicated with the cleaning nozzle. The wafer automatic cleaning device realizes automatic cleaning of the wafer, does not cause damage to the wafer itself, reduces manual cleaning of a back surface of the wafer, avoids breakage and electrostatic breakdown problems caused by manual cleaning, avoids introduction of new particulate impurities in wafer transportation between front and rear process stations, and ensures cleanliness of the wafer during wafer operation.

This invention relates to the field of electroplating technology and discloses a substrate electroplating device, including an electroplating module, an electroplating solution storage tank, a power module, a power supply module, and a loading / unloading module. The electroplating module includes an electroplating chamber and an electroplating assembly. The electroplating chamber consists of a first cavity and a second cavity arranged correspondingly. The electroplating assembly includes a first anode and a second anode arranged correspondingly in the vertical direction. A first spray element and a second spray element, a first cathode and a second cathode are arranged correspondingly between the first anode and the second anode. A return pipe is provided between the electroplating solution storage tank and the first cavity, and an overflow pipe is provided between the electroplating solution storage tank and the second cavity. The power module transports the electrolyte from the electroplating solution storage tank to the electroplating chamber. It can be seen that the substrate electroplating device of this solution has a reasonable overall design and adopts a horizontal electroplating method, which can avoid the problem of substrate breakage during clamping and subsequent operation. At the same time, the double-sided electroplating method has a more uniform plating effect.

The application discloses a kind of warping LED chip protection liquid method, in turn is chip front face film, back cutting, chip overturn, protection liquid drop, protective film covers, vacuum adsorption and centrifugal rotation.Combining the warping characteristics of the existing grinding method to the LED chip, by chip front face film, reduce the risk of chip fragment, chip back cutting releases grinding stress to reduce chip warping, protective film covers can guarantee that all areas of warping LED chip are wrapped with protection liquid, centrifugal rotation makes the protection liquid of LED chip surface everywhere uniform, forms tight and uniform protective layer on the surface of LED chip, plays the role of isolation heat and metal debris when laser cutting, achieves the effect that chip surface circuit is not oxidized and chip is not broken edge, after laser cutting, clean up metal debris and residual protective layer completely.

A detachable orthodontic auxiliary arch tube device comprises a main body, the main body is provided with an installation opening used for installing a fixed orthodontic appliance, the installation opening penetrates through the front face and the bottom face of the main body, the side wall of the main body is further connected with a carrying tube, and the carrying tube is connected with a detachable auxiliary arch tube. After the auxiliary arch wire is arranged in the auxiliary arch tube, the whole auxiliary arch tube device is positioned on a specific tooth position, so that the auxiliary arch wire only applies force to the tooth position, and compared with an existing mode of applying force to the whole main arch wire, the auxiliary arch tube device can avoid applying force to the dentition in a segmented or whole-section manner, so that the correction efficiency and the correction effect are effectively improved.

This invention discloses an ultra-thin flexible glass cleaning system, belonging to the field of ultra-thin flexible glass technology. The technical solution includes a glass conveying mechanism and a glass loading mechanism with its loading end. Glass from the glass roll is conveyed to the glass conveying mechanism via the glass loading mechanism. Above the glass conveying mechanism, from the loading end to the unloading end, are sequentially arranged a cleaning adhesive dispensing mechanism, an adhesive spreading mechanism, a cooling mechanism, and an adhesive peeling mechanism. These mechanisms sequentially drip cleaning adhesive onto the glass on the glass conveying mechanism, spread the cleaning adhesive evenly on the glass, cool the cleaning adhesive, and peel off the cleaning adhesive, ultimately removing dust and dirt from the glass. This invention utilizes the dust-adhesion and dirt-removing principle of the cleaning adhesive, avoiding the breakage and scratches caused by brushes during traditional flatbed cleaning, while enabling rapid and efficient cleaning of the ultra-thin flexible glass surface. Furthermore, it can continuously clean uncut rolls of ultra-thin flexible glass, improving efficiency.