Flexible substrate, manufacturing method thereof and flexible display device

A flexible substrate and manufacturing method technology, applied in identification devices, semiconductor/solid-state device manufacturing, instruments, etc., can solve problems such as wrinkles and fragments of flexible substrates, and achieve the effects of preventing wrinkles and fragments, improving stability, and improving yield.

Active Publication Date: 2020-12-11
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiments of the present application provide a flexible substrate and its manufacturing method, and a flexible display device, which can solve the problem in the prior art that when the flexible substrate and the substrate are peeled off, the air pressure generated at the separation interface impacts the flexible substrate, which causes wrinkles and fragments of the flexible substrate. technical issues

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  • Flexible substrate, manufacturing method thereof and flexible display device
  • Flexible substrate, manufacturing method thereof and flexible display device
  • Flexible substrate, manufacturing method thereof and flexible display device

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Embodiment Construction

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the a...

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Abstract

The invention discloses a flexible substrate, a manufacturing method thereof and a flexible display device. The method comprises the following steps: S10, preparing a first aerogel layer on a substrate, wherein the first aerogel layer is provided with a cross-linked structure and a nanopore structure; S20, preparing an inorganic layer on the first aerogel layer; S30, preparing a second flexible substrate layer on the first aerogel layer, and covering the inorganic layer; and S40, stripping the first aerogel layer, the inorganic layer and the second flexible substrate layer from the base to form the flexible substrate. Compared with the prior art, the manufacturing method prevents the flexible substrate from being folded and broken in the stripping process, the product yield is improved, and the bending performance and stability of the flexible substrate are further improved.

Description

technical field [0001] The present application relates to the field of display technology, and in particular to a flexible substrate, a manufacturing method thereof, and a flexible display device having the flexible substrate. Background technique [0002] Self-luminous display technology, such as OLED and Micro-LED, has the characteristics of high contrast, short response time, high viewing angle and wide color gamut, and has become the next-generation display technology. Flexible self-luminous technology can endow display panels with wider App direction. [0003] In the prior art, polyimide has become the material of choice for flexible self-luminous substrates due to its excellent heat resistance and low thermal expansion coefficient. When preparing flexible substrates, the separation between the flexible substrate and the glass substrate is mainly through The laser lift-off process is realized, and the specific process steps include: laser is irradiated from the bottom ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L27/12G09F9/30
CPCH01L21/6835H01L27/1218G09F9/301H01L2221/68345H01L2221/68386C08J7/0423C08J2300/00C08J2479/08C08J3/244Y02P20/54H10K2102/311H10K77/111
Inventor 李林霜
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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