Substrate optical detection method and apparatus

Abstract

The invention relates to an optical detection method and a device thereof which are used for detecting the defects of a substrate. The optical detection device comprises an optical unit used for generating a light source to radiate the substrate and a plurality of groups of receiving inductor units of more than one dimension used for receiving an image generated by the radiated substrate, wherein, the light wave of the image contains a specific wavelength section as well as an image capture processing unit for capturing the image.

Description

technical field [0001] The present invention relates to an optical detection method and device, in particular to an optical detection method and device applied to substrate defect detection. Background technique [0002] The detection and analysis of substrate defects is very important in the industrial process. Taking the microcracks of solar panels as an example, there are many reasons for their occurrence, including raw material defects, handling during and between processes, etc. may cause microcracks, and Since the raw material of solar panels is mainly silicon chips, and the junction of silicon chips is easy to cause fragmentation inside or on the surface, the occurrence of fragmentation will seriously affect the process equipment, and will also affect the power generation efficiency of solar panels. [0003] At present, there are generally two ways to detect substrate defects. One is to measure the current-voltage characteristics of the substrate, and the other is to ...

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Problems solved by technology

[0004] 1. Reduced process yield: Use the current-voltage characteristic to detect microcracks. The detection of defects is after the process and before shipment, so the only treatment that can be done is scrap or downgrade, so the process yield has been reduced. For The improvement of the process does not help much, but the loss has already occurred, which directly affects the cost of materials and labor invested in production

In addition, the phenomenon of micro-cracking cannot respond to current-voltage in very slight cases, but it will make the product easy to break during handling

[0005] 2. A large number of missed inspections: With the current strong light detection technology, such as visible light as strong light irradiation, due to substrate defects may occur on the surface and inside, and most of them will not penetrate the entire cross-section of the substrate, so The strong light will not be able to penetrate the cracks that occur inside the substrate junction, that is, a large number of missed inspections will occur in the visual inspection or detection using the strong light, which will cause the problem of poor detection efficiency

[0006] 3. Difficult to control quality: the sensitivity of the current-voltage characteristic method is insufficient and it is a post-process detection, and the strong light detection is prone to a large number of missed detections, which will make it difficult to control the quality of the production line, and also form potential hazards to the process machines, such as The micro-cracks of the solar panel are broken inside the machine during the manufacturing process. In addition to affecting the production capacity, it will also cause harm to the quality of subsequent products.

[0007] 4. Unable to perform statistical process analysis: The previous technology could not effectively record the characteristics and classification of defects, and the correlation between the characteristics of defects and the manufacturing process could not be effectively collected, which was of no help to the improvement of the manufacturing process.

[0008] 5. High fragmentation rate during detection: There is no good auxiliary support or manual grasping during detection, which makes the probability of fragmentation high, resulting in waste of production

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