Magnetron sputtering coating system

A magnetron sputtering coating and DC sputtering technology, which is applied in the field of magnetron sputtering coating systems, can solve the problems of large square resistance of the film layer, high fragmentation rate, difficulty in meeting the needs of On-cell touch screens, etc., to meet the requirements of coating Process requirements, the effect of improving production yield

Active Publication Date: 2014-05-28
WGTECH JIANGXI
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Problems solved by technology

Magnetron sputtering needs to be carried out at a certain high temperature and a certain degree of vacuum, so that there is a problem of high fragmentation ra...

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  • Magnetron sputtering coating system
  • Magnetron sputtering coating system
  • Magnetron sputtering coating system

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Embodiment Construction

[0023] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0024] see figure 1 , the magnetron sputtering coating system 200 of one embodiment, comprises the advance chamber 10 arranged in line, the first buffer chamber 20, the first transition chamber 30, the sputtering coating chamber 40, the second transition chamber 50, the second Buffer...

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Abstract

The invention relates to a magnetron sputtering coating system, comprising a linearly arranged slice entering chamber, a first buffer chamber, a first transition chamber, a sputtering coating chamber, a second transition chamber, a second buffer chamber and a slice discharging chamber, wherein the sputtering coating chamber comprises a first direct current sputtering chamber, a second direct current sputtering chamber, a third direct current sputtering chamber and a fourth direct current sputtering chamber which are connected successively. The first direct current sputtering chamber is connected to the first transition chamber; the fourth direct current sputtering chamber is connected to the second transition chamber; the first direct current sputtering chamber is provided with two first cathode targets; the second direct current sputtering chamber is provided with two second cathode targets; the third direct current sputtering chamber is provided with two third cathode targets; and the fourth direct current sputtering chamber is provided with two fourth cathode targets. By using the magnetron sputtering coating system for coating, fragment rate can be effectively reduced; coating of the film with relatively low sheet resistance can be facilitated; process requirements of on-cell coating are met; and production yield is increased.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering coating, in particular to a magnetron sputtering coating system. Background technique [0002] Magnetron sputtering coating is a coating method commonly used at present. Magnetron sputtering needs to be carried out at a certain high temperature and a certain degree of vacuum, so that there is a problem of high fragmentation rate when using the current magnetron sputtering coating system for magnetron sputtering coating; The resistance is large, and it is difficult to meet the requirements of the On-cell touch screen. Contents of the invention [0003] Based on this, it is necessary to provide a magnetron sputtering coating system capable of improving production yield and preparing thin films with low square resistance. [0004] A magnetron sputtering coating system, comprising a film feeding chamber, a first buffer chamber, a first transition chamber, a sputtering coating chamber,...

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/56
Inventor 张迅阳威欧阳小园易伟华
Owner WGTECH JIANGXI
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