Carboxyl group-containing polyurethane, heat-curable resin composition and uses thereof

A technology of polyurethane resin and thermosetting resin, which is applied in the field of thermosetting resin composition, which can solve the problems of poor substrate adhesion, etc., and achieve the effects of excellent soldering heat resistance, excellent long-term reliability, and low twist

Inactive Publication Date: 2008-05-07
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cured product of this resin has poor adhesion to the substrate
This prior art uses specific solvents such as N-methyl-2-pyrrolidone which can dissolve emulsifiers in screen printing, often causing problems

Method used

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  • Carboxyl group-containing polyurethane, heat-curable resin composition and uses thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment a1

[0207] To the reaction vessel equipped with a stirrer, a thermometer and a condenser, 1172 g of polymer polyol polybutadiene (G-1000 manufactured by NIPPON SODA CO., LTD.) having 1,2-repeating units, 184.5 g of carboxyl group-containing The dihydroxy compound 2,2-dimethylolbutyric acid (manufactured by Nippon Kasei Chemical Co., Ltd.) and 1744 g of diethylene glycol ethyl ether acetate (manufactured by DAICEL CHEMICAL INDUSTRIES, LTD.) as a solvent. The material was dissolved at 90°C. The temperature of the reaction liquid was lowered to 70° C., and 125 g (0.48 mol) of polyisocyanate DESMODUR W (manufactured by Sumika Bayer Urethane Co., Ltd.) was added dropwise with a dropping funnel over 30 minutes. After the dropwise addition was complete, the reaction was allowed to proceed at 80°C for 3 hours, at 90°C for 3 hours, and at 100°C for 3 hours. When it was confirmed that the isocyanate substantially disappeared, 4.4 g (0.06 mol) of isobutanol (manufactured by Wako Pure Chemic...

Embodiment a2

[0210] 73.9 g of polymer polyol polybutadiene (G-1000 manufactured by NIPPON SODA CO., LTD.) having 1,2-repeating units were added to a reaction vessel equipped with a stirrer, a thermometer, and a condenser, 12.0 g containing 2,2-dimethylolpropionic acid (manufactured by Nippon Kasei Chemical Co., Ltd.), a dihydroxy compound of carboxyl group, and 125.1 g of diethylene glycol ethyl ether acetate (manufactured by DAICELCHEMICAL INDUSTRIES, LTD.) as a solvent. The material was dissolved at 90°C. The temperature of the reaction liquid was lowered to 70° C., and 36.0 g (0.137 mol) of polyisocyanate DESMODUR W (manufactured by Sumika Bayer Urethane Co., Ltd.) was added dropwise with a dropping funnel over 30 minutes. After the dropwise addition was complete, the reaction was carried out at 80°C for 1 hour, 90°C for 1 hour, and 100°C for 1.5 hours. When it was confirmed that the isocyanate substantially disappeared, 2.0 g (0.027 mol) of isobutanol (manufactured by Wako Pure Chemic...

Embodiment a3

[0213] 89.8 g of polymer polyol polybutadiene (G-1000 manufactured by NIPPON SODA CO., LTD.) having 1,2-repeating units were added to a reaction vessel equipped with a stirrer, a thermometer, and a condenser, 6.61 g containing 2,2-dimethylolbutanoic acid (manufactured by Nippon Kasei Chemical Co., Ltd.), a dihydroxy compound of carboxyl group, and 125.0 g of propylene glycol methyl ether acetate (manufactured by DAICELCHEMICAL INDUSTRIES, LTD.) as a solvent. The material was dissolved at 90°C. The temperature of the reaction liquid was lowered to 70° C., and 27.0 g (0.103 mol) of polyisocyanate DESMODUR W (manufactured by Sumika Bayer Urethane Co., Ltd.) was added dropwise with a dropping funnel over 30 minutes. After the dropwise addition was complete, the reaction was allowed to proceed at 80°C for 1 hour, at 90°C for 1 hour, and at 100°C for 1.5 hours. When it was confirmed that the isocyanate substantially disappeared, 1.5 g (0.021 mol) of isobutanol (manufactured by Wako...

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Abstract

Disclosed is a carboxyl group-containing polyurethane (A) produced from a polyol (b) containing at least 10 mol% (relative to the total (100 mol%) of the polyol (b)) of a polyol (b1) which: (i) has a number-average molecular weight of 500 to 50,000; (ii) has 1 to 10 hydroxyl groups per molecule; and (iii) is one or a combination of two or more polyols selected from the group consisting of polybutadiene polyol, polyisoprene polyol, hydrogenated polybutadiene polyol and hydrogenated polyisoprene polyol. The carboxyl group-containing polyurethane (A) is suitable as materials of cured products, for example cured films, that are excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability.

Description

[0001] Cross References to Related Applications [0002] This application is an application filed under 35 U.S.C. §111(a) which requires provisional application 60 / 684,588 filed May 26, 2005 under 35 U.S.C. §111(b) under 35 U.S.C. §119(e)(1) and filing-date benefits of provisional application 60 / 684,589, filed May 26, 2005. technical field [0003] The present invention relates to carboxyl group-containing polyurethanes and heat curable resin compositions comprising said polyurethanes. More specifically, the present application relates to carboxyl group-containing polyurethanes, and heat-curable resin compositions and coating pastes comprising the polyurethanes, which are capable of producing adhesive properties with substrates, low distortion (low Cured product excellent in warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability. Background technique [0004] Surface protection films for flexible printed circuits are, for example, ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/65C08G18/62C08G18/34C08G18/08
Inventor 内田博平川律子宫岛芳生井上浩文木村和弥东幸彦
Owner SHOWA DENKO KK
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