Server layered heat dissipation design method

Abstract

The invention provides a server layered heat dissipation design method. The server layered heat dissipation design method is characterized in that a system is divided into a high temperature area and a low temperature area; the main cooling wind current is focused in the high temperature area; the low temperature area which is formed at the bottom comprises various devices which are small in heating value, heat dissipation can be performed through a power supply cooling fan mainly, and fan resources in the system are fully utilized; a redundant main cooling fan of the system is matched with an integrated air guide groove which is designed in an optimized mode in the high temperature area which is formed at the top, the wind current is required to uniformly pass through a rear IO area after passing through main heating devices such as a CPU (Central Processing Unit) and a memory in a concentrated mode to assist the heat dissipation of secondary heating parts. According to the server layered heat dissipation design method, the cooling fan resources in the system are reasonably utilized, the problem of the decentralized configuration of wind current sources due to the previous dispersing consideration and key optimization of heat dissipation parts is solved, the mutual interference of cold and hot partition areas is avoided, the heat dissipation regulation and control on the system is fine on the premise of the full utilization of the cooling fans, and the design requirements of the system for the low noise and low energy consumption are met.

Description

technical field [0001] The invention relates to the field of server system design, in particular to a design method for server layered heat dissipation. Background technique [0002] The cooling design of the server system directly affects the overall stability, noise and power consumption of the system. A good cooling architecture design is very important for the human-computer interaction experience of the whole machine, and it is also an important indicator to measure the quality of a server system design. [0003] Usually, the straight-through heat dissipation channel of the server can solve the current heat dissipation requirements of the system, but the optimization space is very limited. In addition, considering the layout of front and rear components of the system and the needs of user maintenance, the system fan and power supply fan are generally arranged independently. In the current 80+ certification When the power supply is popular, the system fan bears a heavy l...

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Problems solved by technology

[0003] Usually, the straight-through heat dissipation channel of the server can solve the current heat dissipation requirements of the system, but the optimization space is very limited. In addition, considering the layout of front and rear components of the system and the needs of user maintenance, the system fan and power supply fan are generally arranged independently. In the current 80+ certification In the case of popular power supplies, while the system fan bears a heavy load and generates high noise, the power supply fan basically has no heat dissipation pressure due to the better conversion efficiency of the power module.

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