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Thermocompression bonding structure and thermocompression bonding method

一种加压加热、接合结构的技术，应用在粘合方法、焊接/焊接/切割物品、连接等方向，能够解决无法加压加热接合等问题

Active Publication Date: 2014-10-15
FUJI ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since no pressurized force acts on the joint surface on the side side between the side wall of the joint recess and the outer peripheral surface of the electrode, there is an unsolved problem that pressure heating bonding cannot be performed on the joint surface on the side side.

Method used

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  • Thermocompression bonding structure and thermocompression bonding method
  • Thermocompression bonding structure and thermocompression bonding method
  • Thermocompression bonding structure and thermocompression bonding method

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Embodiment Construction

[0041] Hereinafter, an embodiment in a case where the pressure-heat bonding structure and the pressure-heat bonding method of the present invention are applied to a power semiconductor module as a semiconductor device will be described with reference to the drawings.

[0042] Figure 1 ~ Figure 6 A diagram showing the first embodiment in a case where the present invention is applied to a power semiconductor module as a semiconductor device.

[0043] As an example of the power semiconductor module 1 to which the present invention can be applied, such as figure 1 As shown, it is configured as a molded body injection-molded with a resin material such as epoxy resin. This power semiconductor module 1 is formed with insertion holes 2 for inserting fixing screws on the left and right end sides, and an insulating wall 3 having a U-shape in plan view is formed so as to surround these insertion holes 2.

[0044] Furthermore, in the power semiconductor module 1, external connection terminals ...

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PUM

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Abstract

The invention discloses a thermocompression bonding structure and a thermocompression bonding method. The thermocompression bonding structure is a thermocompression bonding structure formed by thermocompression bonding between two members using metal fine particles as a bonding material. In the thermocompression bonding structure, a first member (14) and a second member (4A) having different linear expansion coefficients from each other are disposed so that thermal stress occurring between the first member and the second member acts as pressurizing force on a bonding surface (F2) between the two members. The temperature of the first member and the second member between which the metal fine particles are interposed in the bonding surface is increased to thermocompression bond the first member and the second member. Accordingly, the thermocompression bonding can be effectively carried out even on the orthogonal bonding surface in the compression direction.

Description

Technical field [0001] The present invention relates to a pressure-heating bonding structure and a pressure-heating bonding method for pressure-heating and bonding two parts using metal particles. Background technique [0002] As such a press-heat bonding technique, for example, a technique described in Patent Document 1 has been proposed. In this pressure-heat bonding technology, in order to bond the electrode terminals of the laminated substrate to each other, a transistor and multilayer wiring are formed on the substrate, and an insulating film covering the multilayer wiring is formed, and an opening is formed to The wiring is exposed from the insulating film, and an organic solvent containing conductive fine particles is applied to the opening. Then, after the first heat treatment is performed to remove the solvent and organic components, the conductive particles on the outer part of the opening are removed by the CMP method, so that an electrode terminal made of conductive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H01L21/603H01L25/07
CPCB23K20/026Y10T403/217C09J5/00H01L2924/0002B23K20/16B23K20/023B23K2203/08B23K20/233B23K2101/40B23K2103/10B23K2103/12B23K2103/14B23K2103/18H01L2924/00
Inventor 木下庆人望月英司西泽龙男多田慎司
Owner FUJI ELECTRIC CO LTD
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