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electronic controller lead type light emitting diode led device

A technology of light-emitting diodes and electronic controllers, applied in circuits, electrical components, semiconductor devices, etc., can solve problems such as artificial light-emitting occlusion, and achieve the effect of less light scattering and accurate focusing

Active Publication Date: 2016-08-17
浙江达峰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention solves the problem that the above-mentioned light-emitting diode LED devices often need to be manually welded and the light is blocked, and provides an electronic controller lead-type light-emitting diode LED device

Method used

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Embodiment

[0021] An electronic controller lead-type light-emitting diode LED device, including a transparent packaging shell, a PN junction 4, a reflective bowl, a cathode rod, an anode rod and a lead frame, and is characterized in that it also includes a resin bottom layer packaging, and a resin bottom layer Encapsulation and reflective heat dissipation film, the bottom layer of resin package is arranged on the bottom of the transparent package shell, the top of the resin bottom layer package 1 is coated with resin bottom two-layer package 2, and the top of the resin bottom two-layer package is laid Reflective heat dissipation film 3, the thermal conductivity of the two-layer package at the bottom of the resin is lower than the thermal conductivity of the one-layer package at the bottom of the resin, the thickness of the two-layer package at the bottom of the resin is 0.8 mm to 1.2 mm, and the overall shape of the reflective heat dissipation film is circular , the middle part of the ref...

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PUM

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Abstract

The invention relates to an electronic controller lead type light-emitting diode LED device. According to the invention, the problem that an LED cannot support machine welding is solved. The technical scheme has the following main points: the device provided by the invention also comprises a resin bottom first-layer packaging, a resin bottom second-layer packaging and a reflective heat-dissipation film; the resin bottom first-layer packaging is arranged at the bottom of a transparent packaging housing; the resin bottom second-layer packaging is coated on the resin bottom first-layer packaging; the reflective heat-dissipation film is laid on the resin bottom second-layer packaging; thermal conductivity of the resin bottom second-layer packaging is less than thermal conductivity of the resin bottom first-layer packaging; thickness of the resin bottom second-layer packaging is 0.8 millimeter to 1.2 millimeter; and the whole reflective heat-dissipation film is round; the middle part of the reflective heat-dissipation film is sunken downward to form an arc-shaped reflective part which is coated with a reflecting layer. The device provided by the invention can give out light effectively, and has little light scattering and accurate focusing.

Description

technical field [0001] The invention belongs to a light-emitting diode (LED) device and relates to an electronic controller lead type light-emitting diode (LED) device. Background technique [0002] In the prior art, light-emitting diode (LED) devices are widely used by the public. Energy-saving lamps, indicator lights and ordinary lighting all have diode LED devices. It can be said that the application of LED devices is the trend of the times, and its application will become more and more The more common, and the existing LED technology can be mature, the structure of the LED device can also be unified, basically including: including transparent packaging shell, PN junction, reflective bowl, cathode rod, anode rod and lead frame. Such a structure is indeed simple, easy to manufacture, low in cost, and can be produced and applied on a large scale, but this does not mean that the existing products are perfect and flawless. For example, some shortcomings are not noticed by eve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L33/64
CPCH01L33/54H01L33/60H01L33/642H01L33/644
Inventor 卢成秋许雄飞焦永璠张红兵马建强
Owner 浙江达峰科技有限公司