Chip placing method and device thereof for preventing chip pins from being deformed
A technology of chips and pins, which is applied in the field of chip placement methods and devices for preventing deformation of chip pins, can solve the problems of reducing installation efficiency and assembly time, affecting the service life of chips, and pin bending and deformation, so as to save assembly Time, simple structure, avoiding the effect of pin contact
Inactive Publication Date: 2014-10-22
WUXI HAOBANG HIGH TECH CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
At present, when workers install chips into circuit boards, the chips are randomly and scattered in one place. Since there are multiple pins arranged side by side on the chip, the pins of each chip are easy to touch, causing the pins to bend and deform. It not only affects the service life of the chip, but also greatly reduces the installation efficiency and assembly time, and it is easy to cause the reverse installation of the chip, which increases the occurrence of subsequent assembly failures.
Method used
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Embodiment Construction
[0024] The specific implementation manner of the present invention will be described below in conjunction with the accompanying drawings.
[0025] Such as figure 1 , figure 2 As shown, a device for preventing deformation of chip pins includes a box body 1, the box body 1 is rectangular, and the two ends of the box body 1 are bent upward to form a baffle 2, and the baffle plate 2 is connected with the box body 1 to form an integral body "┗┛" shape, the two ends of the box body 1 and the joints of each baffle plate 2 form a bending angle, and the bending angle is 89°-90°. A plurality of partitions 3 are arranged parallel to each other between two baffles 2 ( figure 1 and figure 2 The number of middle partitions is 5, and the partitions can be increased or decreased according to actual assembly requirements), and the partitions 3 are long rectangular bodies. Open slots 4 for preventing chips 6 are formed between the partitions 3, and grooves 5 for embedding magazines 7 are ...
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The invention relates to a device for preventing chip pins from being deformed. The device comprises a box body, two ends of the box body bend to form baffles, a plurality of partition plates are mutually parallelly arranged between two baffles, an opening groove for preventing chips is formed between each two partition plates, and grooves are formed in at least one baffle. By means of a method, all chips with pins can be orderly arranged on the box body so that conditions of pin contact and pin deformation caused by chip disorder can be avoided, the chips are orderly arranged, meanwhile, the problem of reversely mounting of the chips can be avoided, workers can conveniently take the chips, the labor intensity of the workers can be reduced, assembly time is saved, the assembly efficiency is greatly increased, meanwhile, the device is simple in structure, identification of the chips in different models can be guaranteed by the aid of partitions on the box body, and the grooves are formed in one side of the box body so that embedding of one end of a material box is facilitated and the chips in the material box can be orderly arranged on the box body.
Description
technical field [0001] The invention relates to the field of chip installation, in particular to a chip placement method and a device thereof for preventing deformation of chip pins. Background technique [0002] Chip is the tube name of semiconductor component products and the carrier of integrated circuits, which is divided into wafers. At present, when workers install chips into circuit boards, the chips are randomly and scattered in one place. Since there are multiple pins arranged side by side on the chip, the pins of each chip are easy to touch, causing the pins to bend and deform. It not only affects the service life of the chip, but also greatly reduces the installation efficiency and assembly time, and it is easy to cause the reverse installation of the chip, thereby increasing the occurrence of subsequent assembly failures. Contents of the invention [0003] In view of the above existing problems, the applicant has carried out research and improvement, and p...
Claims
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Inventor 陆舟王晓明
Owner WUXI HAOBANG HIGH TECH CO LTD