ACF (anisotropic conductive film) attaching device

Abstract

The invention provides an AFC (anisotropic conductive film) attaching device, belongs to the technical field of attaching devices, and solves the problem that an existing ACF attaching device is low in attaching efficiency. The ACF attaching device comprises a supplying mechanism, a tape conveying mechanism and a tape pressing mechanism, wherein the supplying mechanism is used for supplying ACF adhesive tapes formed by conductive adhesive films and base bands, the tape conveying mechanism is used for conveying the ACF adhesive tapes supplied by the supplying mechanism along a preset conveying path, and the tape pressing mechanism is used for pressing and fixing the conductive adhesive films of the ACF adhesive tapes conveyed by the tape conveying mechanism on object components to be attached; the tape conveying mechanism comprises a first guide wheel and a supplying wheel which are in contact with each other and used for clamping the ACF adhesive tapes to separate the base bands from the conductive adhesive films by means of allowing a first motor to control the supplying wheel to rotate during the time when the conductive adhesive films of the ACF adhesive tapes are pressed and fixed on the object components to be attached through the tape pressing mechanism.

Description

technical field [0001] The invention belongs to the technical field of attachment devices, and in particular relates to an ACF attachment device. Background technique [0002] At present, almost all kinds of portable electronic products use liquid crystal displays as display panels, especially on products such as camcorders, notebook computers, mobile terminals or personal digital processors, liquid crystal displays have become important components. In addition to the liquid crystal panel, the liquid crystal display must be connected to the driver chip as the control of the display signal. In order to realize the conduction of the chip, a layer of ACF (anisotropic conductive film) needs to be laminated on the flexible circuit board FPC. [0003] There are two attachment methods of the existing ACF conductive adhesive film, which are the pressure head attachment method and the roller attachment method. Among them, the attachment method of the indenter refers to: press the AC...

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Problems solved by technology

[0004] The inventors found that there are at least the following problems in the prior art: Whether it is the attachment method of the pressure head or the attachment method of the roller, the attachment of the ACF conductive adhesive film needs to first stick the ACF tape on the display substrate, and then peel off the ACF base tape Two steps, and the two steps need to be carried out separately and cannot be carried out at the same time, so the attachment time of the ACF conductive adhesive film is longer, which reduces the production efficiency

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