A structurally integrated led packaging structure
A technology of LED packaging and LED chips, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of large air resistance, poor light extraction efficiency, and small contact area, and achieve reduced thermal resistance, good heat dissipation effect, and high heat conduction efficiency effect
Inactive Publication Date: 2017-01-25
SOUTH CHINA UNIV OF TECH
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Problems solved by technology
Although the COB package improves the heat dissipation of high-power LEDs, the contact area between the aluminum substrate and the heat sink is small, the air resistance is large, and there is still a lot of room for improvement in the heat dissipation effect; at the same time, because it is a surface light source, the horizontal part The light is finally absorbed by the interior due to total reflection, which also leads to poor light extraction efficiency
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Embodiment
[0025] Such as figure 1 with 2 As shown, this embodiment discloses a structurally integrated LED packaging structure, which includes an LED chip 2, a heat dissipation area 1 and a packaging substrate 6 formed by die-casting an aluminum plate with a certain thickness, and the LED chip is packaged on the packaging substrate 6; Die-casting on the aluminum plate has a special-shaped groove with an upper opening, and a certain thickness area from the bottom of the groove downwards in the aluminum plate is used as the packaging substrate 6, and the thickness of the packaging substrate 6 should be determined according to the substrate thickness required for COB packaging in different situations. Other parts except the package substrate 6 are die-cast into heat dissipation fins 1 , and there are certain gaps between the heat dissipation fins 1 . Each heat dissipation fin below the package substrate is provided with five ventilation holes 4 and four straight heat pipe through holes 3 ...
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The invention discloses a structurally integrated LED (Light Emitting Diode) packaging structure which comprises LED chips, and a heat dissipation area and a packaging substrate which are formed by die casting of an aluminum plate with certain thickness, wherein a groove with an upper opening is formed in the aluminum plate in a die casting manner; an area starting downwards for certain thickness from the lower part of the groove in the aluminum plate serves as the packaging substrate; the LED chips are packaged on the packaging substrate; other parts except the packaging substrate on the aluminum plate are arranged into heat dissipation fins in a die casting manner; air holes and straight heat pipe through holes used for penetrating through straight heat pipes are formed in the heat dissipation fins below the packaging substrate; and positions of the straight heat pipe through holes formed in the heat dissipation fins are same. According to the packaging structure, structures of the packaging substrate and a heat dissipation part of an LED are integrated by the aluminum plate, so that thermal resistance between the packaging substrate and the heat dissipation part of the LED is reduced, and the packaging structure has the advantages that the packaging structure is good in heat dissipation effect and is suitable for a high-power LED.
Description
technical field [0001] The invention relates to an LED packaging structure, in particular to a structurally integrated LED packaging structure. Background technique [0002] As we all know, LED has attracted much attention because of its high luminous efficiency, low light decay, long life, fast response, impact resistance, and environmental protection, and it is gradually becoming the next generation of light sources. However, with the wide application of LEDs and the continuous improvement of performance, the heat dissipation problem of high-power LEDs has gradually been exposed, and has become the main factor affecting the service life and stability of LEDs. [0003] In recent years, the demand for high-power LED packaging has gradually become thinner and more cost-effective, while COB light sources are favored by the market due to their low cost, convenient application and diversified designs. The popular COB technology on the market to solve the heat dissipation proble...
Claims
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IPC IPC(8): H01L33/48H01L33/64H01L33/58
CPCH01L33/483H01L33/58H01L33/642H01L33/648
Inventor 文尚胜马丙戌陈颖聪梁伟鸿刘磊刘涵
Owner SOUTH CHINA UNIV OF TECH