Quad flat no-lead package

A square, flat, leadless technology, applied to electrical components, electrical solid devices, circuits, etc., can solve the problem that QFN packages are easily damaged

Inactive Publication Date: 2014-11-12
HUAWEI TECH CO LTD
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, QFN packages are easily damag

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Quad flat no-lead package
  • Quad flat no-lead package
  • Quad flat no-lead package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] see figure 2 , which is a top view corresponding to Embodiment 1 of the QFN package provided by the present invention.

[0038] The QFN package provided by the present invention includes: an exposed pad B, an electrode contact C and a reinforced connection pad A;

[0039] The exposed pad B is located at the center of the bottom of the QFN package;

[0040] It should be noted that the exposed pad B has a larger area.

[0041] The electrode contacts C are arranged around the periphery of the QFN package;

[0042] It should be noted that the number of electrode contacts on opposite sides is the same. There are no electrode contacts on the four corners of the QFN package.

[0043] The QFN package can be square or rectangular.

[0044] The four corners of the QFN package are respectively provided with one of the enhanced connection pads A.

[0045] It can be understood that a total of four enhanced connection pads A are provided at the four corners of the QFN package....

Embodiment 2

[0048] see image 3 , which is a top view corresponding to Embodiment 2 of the QFN package provided by the present invention.

[0049] In order to facilitate processing and cutting, the top of the four corners in the QFN package provided in this embodiment can reserve a triangular area, such as image 3 The four corners of the four reinforced connection pads A shown are reserved for a triangular area A1.

[0050] It should be noted that the enhanced connection pad A may be conductive or non-conductive according to the functional requirements of the actual chip.

[0051] In the QFN package provided in this embodiment, a triangular area is reserved at the four corners of the QFN package, and the triangular area is a filling area reserved for the boundary between the reinforced connection pad and the plastic-encapsulated QFN package. When the relatively large QFN package frame is divided into individual QFN packages, the burr caused by the enhanced connection pad can be avoided...

Embodiment 3

[0053] see Figure 4-5 , which is a front sectional view corresponding to Embodiment 3 of the QFN package provided by the present invention.

[0054] This figure is the main cross-sectional view, and the exposed pad B and electrode contact C of the QFN package can be seen.

[0055] In the QFN package provided in this embodiment, a bottom trench D is provided at the bottom of the exposed pad B.

[0056]It can be understood that, the bottom trench D divides the bottom of the exposed pad B into different regions; or the bottom trench D divides the bottom of the exposed pad B into different regions.

[0057] in addition, Figure 4 Among them, F is chip bonding (bonding line), E is bare chip, H is side climbing tin, and G is PCB.

[0058] Climbing tin H on the side can increase the connection between the QFN package and the PCB, making the connection between the two more reliable.

[0059] see Figure 6 , which is a top view corresponding to Embodiment 3 provided by the presen...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a quad flat no-lead (QFN) package which comprises an exposed bonding pad, electrode contacts and reinforcement connection bonding pads. The exposed bonding pad is located in the center of the bottom of the QFN package. The electrode contacts are arranged around the periphery of the QFN package. The four corners of the QFN package are provided with the reinforcement connection bonding pads respectively. According to the QFN package, the reinforcement connection bonding pads are additionally arranged on the four corners of the QFN package, no reinforcement connection bonding pad is arranged on a QFN package in the prior art, the QFN package is connected with a PCB when being used, and the electrode contacts in the QFN package are damaged easily by stress if no reinforcement connection bonding pad is arranged; the reinforcement connection bonding pads are additionally arranged, when the QFN package bears the mechanical stress, the reinforcement connection bonding pads on the four corners and welding spots of the PCB bear the stress firstly, and thus damage to connection between the electrode contacts which are located on the inner side and electrically connected and the PCB can be avoided; the mechanical stress born by the electrode contacts which is located on the inner side due to thermal shock and long-term operation can be lowered, and reliable connection between the electrode contacts on the inner side and the PCB can be kept.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a quad flat no-lead (QFN, Quad Flat No-lead) package. Background technique [0002] In integrated circuits, chips that implement various functions need to be packaged, and QFN package is a square flat non-leaded semiconductor chip package structure. Since the QFN package does not have the wing-shaped leads like the traditional Small Outline Integrated Circuit Package (SOIC, Small Outline Integrated Circuit Package) and Thin Small Outline Package (TOSP, Thin Small Outline Package), the internal pins and pads of the QFN package The conductive path between them is short, the self-inductance coefficient and the internal wire resistance of the package are very low, so it can provide excellent electrical performance. [0003] The QFN package in the prior art is mainly packaged in a unit display frame and then cut into independent units. However, the electrical connection b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L23/495H01L23/31
CPCH01L2224/48091H01L2224/48247
Inventor 侯召政吕沛
Owner HUAWEI TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap