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Method capable of achieving internal storage local heating for high-temperature control test

A local heating and high temperature control technology, applied in the computer field, can solve the problem that the environment cannot reach the ideal temperature, and achieve the effects of convenient heating and temperature control, reasonable design, and simple and convenient operation

Inactive Publication Date: 2014-11-19
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But in many cases, the customer's environment cannot reach the ideal temperature, causing a series of problems during use

Method used

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  • Method capable of achieving internal storage local heating for high-temperature control test
  • Method capable of achieving internal storage local heating for high-temperature control test

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] First, make a heat preservation cover for use. The structure of the heat preservation cover is as follows: the shell 1 of the heat preservation cover is in the shape of a rectangular hexahedron, made of high temperature resistant insulating plastic, with an open bottom and a circular through hole in the middle of the top. An exhaust fan 2 is installed at the circular through hole; two flexible heating sheets 3 are respectively installed on the inner wall on both sides of the inner cavity of the housing 1 , and a temperature sensor 4 is installed on the upper side of one end of the inner wall of the housing 1 . The exhaust fan 2 and the flexible heating sheet 3 are controlled by relays and digital tubes, the relays and digital tubes are installed on the main board and connected to the exhaust fan 2 and the flexible heating sheet 3 respectively through wires, and the power supply part is 12V DC, provided by the main board power supply.

[0018] The method steps are as foll...

Embodiment 2

[0021] First, make a heat preservation cover for use. The structure of the heat preservation cover is as follows: the shell 1 of the heat preservation cover is in the shape of a rectangular hexahedron, made of high temperature resistant insulating plastic, with an open bottom and a circular through hole in the middle of the top. An exhaust fan 2 is installed at the circular through hole; five flexible heating sheets 3 are respectively installed on the inner wall on both sides of the inner cavity of the housing 1 , and a temperature sensor 4 is installed on the upper side of one end of the inner wall of the housing 1 . The exhaust fan 2 and the flexible heating sheet 3 are controlled by relays and digital tubes, the relays and digital tubes are installed on the main board and connected to the exhaust fan 2 and the flexible heating sheet 3 respectively through wires, and the power supply part is 12V DC, provided by the main board power supply.

[0022] The method steps are as fol...

Embodiment 3

[0025] First, make a heat preservation cover for use. The structure of the heat preservation cover is as follows: the shell 1 of the heat preservation cover is in the shape of a rectangular hexahedron, made of high temperature resistant insulating plastic, with an open bottom and a circular through hole in the middle of the top. A 3cm*3cm exhaust fan 2 is installed at the circular through hole; three 20W flexible heating fins 3 are respectively installed on the inner walls of the inner chamber of the housing 1, and one end of the inner wall of the housing 1 is installed on the upper side temperature sensor4. The exhaust fan 2 and the flexible heating sheet 3 are controlled by relays and digital tubes, the relays and digital tubes are installed on the main board and connected to the exhaust fan 2 and the flexible heating sheet 3 respectively through wires, and the power supply part is 12V DC, provided by the main board power supply.

[0026] The method steps are as follows:

...

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Abstract

The invention discloses a method capable of achieving internal storage local heating for a high-temperature control test and belongs to the technical field of computers. The method includes the steps that a heat-preserving cover with an extractor fan and a flexible heating piece is connected to a mainboard in a clamped mode, an internal storage slot in the mainboard is covered with the heat-preserving cover, a temperature sensor is installed on the upper side of the inner wall of the heat-preserving cover and used for monitoring the temperature in the heat-preserving cover in real time, when the temperature in the heat-preserving cover is lower than 85 DEG C, the temperature in the heat-preserving cover is increased through connection of the flexible heating piece, and meanwhile, the extractor fan is disconnected; when the temperature in the heat-preserving cover is higher than 85 DEG C, the temperature in the heat-preserving cover is lowered through the extractor fan, and meanwhile, the flexible heating piece is disconnected; the temperature in the heat-preserving cover is controlled so that the purpose of the high-temperature test is achieved. The method has the advantages of being reasonable in design, easy and convenient to operate and the like, no large devices such as a high-temperature and low-temperature box are needed, heating and temperature control of an internal storage are facilitated, and the effect that the temperature of the internal storage is controlled and adjusted is achieved.

Description

[0001] technical field [0002] The invention relates to the technical field of computers, in particular to a method capable of realizing local heating of memory for high-temperature control testing. Background technique [0003] During the use of the server, the ambient temperature has a great impact on the normal operation and effective utilization of the server, especially the memory. The technical equipment and information recording media of various series of servers have technical regulations on the parameter range of environmental conditions. If these regulations are exceeded or not met, the reliability of the server memory will be reduced and the service life will be shortened. If the temperature is too high, the heat generated by memory components and integrated circuits cannot be dissipated, thereby accelerating the aging of semiconductor materials and causing temporary or permanent microscopic changes inside. In fact, when the ambient temperature exceeds 85°C, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/26G05D23/20
Inventor 刘胜
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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