The invention relates to the technical field of heat dissipation materials, in particular to a Bi-In-Sn
liquid metal phase change material for
chip heat dissipation, a preparation method and a heat dissipation device, and is technically characterized in that the
liquid metal phase change material is prepared from the following elements in percentage by
mass: 42.0%-48.0% of Bi, 33.0%-40.0% of In and 12%-25% of Sn; the preparation method comprises the following steps: weighing Bi, In and Sn
metal particles, and sequentially carrying out acid
pickling, ultrasonic cleaning and
drying treatment; under the high-purity
argon protection environment, the pretreated
metal particles are subjected to vacuum melting and stirring, and uniform
liquid alloy is formed; and after the
liquid alloy is cooled and formed, ultrasonic treatment is conducted, the Bi-In-Sn
liquid metal phase change material is prepared, the
advantage of
low melting point is kept, meanwhile, unexpected improvement of
latent heat performance is achieved, and the
bottleneck problem of instantaneous
thermal runaway of a
chip in an
extreme environment is effectively solved.